SNIS169F March   2013  – May 2024 LMT86

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Accuracy Characteristics
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LMT86 Transfer Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mounting and Thermal Conductivity
      2. 7.4.2 Output Noise Considerations
      3. 7.4.3 Capacitive Loads
      4. 7.4.4 Output Voltage Shift
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Connection to an ADC
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Conserving Power Dissipation With Shutdown
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Electrical Characteristics

Unless otherwise noted, these specifications apply for +VDD = 2.2 V to 5.5 V. MIN and MAX limits apply for TA = TJ = TMIN to TMAX , unless otherwise noted; typical values apply for TA = TJ = 25°C.
PARAMETERTEST CONDITIONSMIN(1)TYP(2)MAX(1)UNIT
Average sensor gain (output transfer function slope)–30°C and 90°C used to calculate average sensor gain–10.9mV/°C
Load regulation(3)Source ≤ 50 μA, (VDD – VOUT) ≥ 200 mV–1–0.22mV
Sink ≤ 50 μA, VOUT ≥ 200 mV0.261mV
Line regulation(4)200μV/V
ISSupply currentTA = 30°C to 150°C, (VDD – VOUT) ≥ 100 mV5.48.1μA
TA = –50°C to 150°C, (VDD – VOUT) ≥ 100 mV5.49μA
CLOutput load capacitance1100pF
Power-on time(5)CL= 0 pF to 1100 pF0.71.9ms
Output driveTA = TJ = 25°C–5050µA
(1) Limits are specific to TI's AOQL (Average Outgoing Quality Level).
(2) Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
(3) Source currents are flowing out of the LMT86. Sink currents are flowing into the LMT86.
(4) Line regulation (DC) is calculated by subtracting the output voltage at the highest supply voltage from the output voltage at the lowest supply voltage. The typical DC line regulation specification does not include the output voltage shift discussed in Output Voltage Shift.
(5) Specified by design and characterization.