SNIS169F March   2013  – May 2024 LMT86

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Accuracy Characteristics
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LMT86 Transfer Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mounting and Thermal Conductivity
      2. 7.4.2 Output Noise Considerations
      3. 7.4.3 Capacitive Loads
      4. 7.4.4 Output Voltage Shift
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Connection to an ADC
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Conserving Power Dissipation With Shutdown
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)(2)LMT86LMT86LPLMT86LPGUNIT
DCK (SOT/SC70)LP/LPM (TO-92)LPG (TO-92S)
5 PINS3 PINS3 PINS
RθJAJunction-to-ambient thermal resistance (3)(4)275167130.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance849064.2°C/W
RθJBJunction-to-board thermal resistance56146106.2°C/W
ψJTJunction-to-top characterization parameter1.23514.6°C/W
ψJBJunction-to-board characterization parameter55146106.2°C/W
(1) For information on self-heating and thermal response time, see section Mounting and Thermal Conductivity.
(2) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
(3) The junction to ambient thermal resistance (RθJA) under natural convection is obtained in a simulation on a JEDEC-standard, High-K board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are included in the PCB, per JESD 51-5.
(4) Changes in output due to self-heating can be computed by multiplying the internal dissipation by the thermal resistance.