SNIS169F March   2013  – May 2024 LMT86

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Accuracy Characteristics
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LMT86 Transfer Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mounting and Thermal Conductivity
      2. 7.4.2 Output Noise Considerations
      3. 7.4.3 Capacitive Loads
      4. 7.4.4 Output Voltage Shift
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Connection to an ADC
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Conserving Power Dissipation With Shutdown
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Mounting and Thermal Conductivity

The LMT86 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface.

To ensure good thermal conductivity, the backside of the LMT86 die is directly attached to the GND pin. The temperatures of the lands and traces to the other leads of the LMT86 will also affect the temperature reading.

Alternatively, the LMT86 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LMT86 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. If moisture creates a short circuit from the output to ground or VDD, the output from the LMT86 will not be correct. Printed-circuit coatings are often used to ensure that moisture cannot corrode the leads or circuit traces.

The thermal resistance junction to ambient (RθJA or θJA) is the parameter used to calculate the rise of a device junction temperature due to its power dissipation. Use Equation 7 to calculate the rise in the LMT86 die temperature:

Equation 7. LMT86

where

  • TA is the ambient temperature,
  • IS is the supply current,
  • ILis the load current on the output,
  • and VO is the output voltage.

For example, in an application where TA = 30°C, VDD = 5 V, IS = 5.4 µA, VO = 1777 mV junction temp 30.014°C self-heating error of 0.014°C. Because the junction temperature of the LMT86 is the actual temperature being measured, take care to minimize the load current that the LMT86 is required to drive. The Thermal Information(1) table shows the thermal resistance of the LMT86.

1. For information on self-heating and thermal response time, see section Mounting and Thermal Conductivity.