SLOS263Y august   1999  – august 2023 LMV321 , LMV324 , LMV358

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: LMV321
    5. 6.5 Thermal Information: LMV324
    6. 6.6 Thermal Information: LMV358
    7. 6.7 Electrical Characteristics: VCC+ = 2.7 V
    8. 6.8 Electrical Characteristics: VCC+ = 5 V
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Unity-Gain Bandwidth
      3. 7.3.3 Slew Rate
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Design Requirements
      2. 8.1.2 Detailed Design Procedure
        1. 8.1.2.1 Amplifier Selection
        2. 8.1.2.2 Passive Component Selection
      3. 8.1.3 Application Curves
    2. 8.2 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DCK|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision X (May 2020) to Revision Y (August 2023)

  • Updated the Device Information table to include channel count and package lead sizeGo

Changes from Revision W (October 2014) to Revision X (May 2020)

  • Deleted LMV324S mentions on the front page of the data sheet Go
  • Added recommended device notice for LMV321A, LMV358A, and LMV324AGo
  • Changed Device Information table to sort devices by channel count in ascending orderGo
  • Changed Pin Configuration and Functions section by dividing the Pin Functions table into separate tables per deviceGo
  • Deleted LMV324S pinout information Go
  • Changed HBM ESD voltage from 2500 V to 2000 VGo
  • Changed CDM ESD voltage from 1500 V to 1000 VGo
  • Deleted Shutdown voltage threshold for LMV324SGo
  • Changed Thermal Information section by dividing the Thermal Information table into separate tables per deviceGo
  • Changed Thermal Information for LMV321 Go
  • Deleted LMV324S Thermal Information Go
  • Changed Thermal Information for LMV324 Go
  • Changed Thermal Information for LMV358 Go
  • Deleted LMV324S test condition for supply current Go
  • Changed output short-circuit current for sourcing from 60 mA to 40 mA Go
  • Changed output short-circuit current for sinking from 160 mA to 40 mA Go
  • Added specified by characterization table notes to output short-circuit current, output swing, and input bias current specifications Go