SLOSE67D june   2020  – april 2023 LMV321A-Q1 , LMV324A-Q1 , LMV358A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: LMV321A-Q1
    5. 6.5 Thermal Information: LMV358A-Q1
    6. 6.6 Thermal Information: LMV324A-Q1
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Input Common Mode Range
      3. 7.3.3 Rail-to-Rail Output
      4. 7.3.4 Overload Recovery
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 LMV3xxA-Q1 Low-Side, Current Sensing Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Single-Supply Photodiode Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Input and ESD Protection
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (January 2023) to Revision D (April 2023)

  • Changed the status of the DBV package from: preview to: active Go

Changes from Revision B (October 2021) to Revision C (January 2023)

  • Deleted preview note from the SC70 (5) packages in Device Information tableGo
  • Changed the formatting of the Pin Configuration and Functions sectionGo
  • Changed values in Thermal Information: LMV321A-Q1 tableGo

Changes from Revision A (April 2021) to Revision B (October 2021)

  • Added LMV321A-Q1 GPN to the data sheetGo
  • Added SOT-23 (5) and SC70 (5) packages in Device Information tableGo
  • Deleted preview note from SOT-23 (14) and TSSOP (14) packages in Device Information tableGo
  • Added LMV321A-Q1 SOT-23 (5), SC70 (5), and LMV321AU-Q1 SOT-23 (5) Packages, to Pin Configuration and Functions sectionGo
  • Added Thermal Information: LMV321A-Q1 tableGo

Changes from Revision * (June 2020) to Revision A (April 2021)

  • Updated the numbering format for tables, figures and cross-references throughout the documentGo
  • Deleted preview note from VSSOP (8) package in Device Information tableGo
  • Deleted SOT-23 (8), TSSOP (8), SOT-23 (5), and SC70 (5) packages from Device Information tableGo
  • Deleted TSSOP (8) Package, from Pin Configuration and Functions sectionGo
  • Added note (4) to differential input voltage in Absolute Maximum Ratings tableGo
  • Added thermal information for DGK packageGo
  • Added thermal information for DYY packageGo