SNOSC69D April   2012  – March 2017 LMV611 , LMV612 , LMV614

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - 1.8 V (DC)
    6. 6.6  Electrical Characteristics - 1.8 V (AC)
    7. 6.7  Electrical Characteristics - 2.7 V (DC)
    8. 6.8  Electrical Characteristics - 2.7 V (AC)
    9. 6.9  Electrical Characteristics - 5 V (DC)
    10. 6.10 Electrical Characteristics - 5 V (AC)
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input and Output Stage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Input Bias Current Consideration
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Half-Wave Rectifier With Rail-to-Ground Output Swing
      2. 8.1.2 Instrumentation Amplifier With Rail-to-Rail Input and Output
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Current Sensing
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Custom Design With WEBENCH® Tools
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.