SNOSC69D April   2012  – March 2017 LMV611 , LMV612 , LMV614

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - 1.8 V (DC)
    6. 6.6  Electrical Characteristics - 1.8 V (AC)
    7. 6.7  Electrical Characteristics - 2.7 V (DC)
    8. 6.8  Electrical Characteristics - 2.7 V (AC)
    9. 6.9  Electrical Characteristics - 5 V (DC)
    10. 6.10 Electrical Characteristics - 5 V (AC)
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input and Output Stage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Input Bias Current Consideration
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Half-Wave Rectifier With Rail-to-Ground Output Swing
      2. 8.1.2 Instrumentation Amplifier With Rail-to-Rail Input and Output
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Current Sensing
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Custom Design With WEBENCH® Tools
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

To properly bypass the power supply, several locations on a printed-circuit board must be considered. A
6.8-µF or greater tantalum capacitor must be placed at the point where the power supply for the amplifier is introduced onto the board. Another 0.1-µF ceramic capacitor must be placed as close as possible to the power supply pin of the amplifier. If the amplifier is operated in a single power supply, only the V+ pin must be bypassed with a 0.1-µF capacitor. If the amplifier is operated in a dual power supply, both V+ and V– pins must be bypassed.

It is good practice to use a ground plane on a printed-circuit board to provide all components with a low inductive ground connection.

TI recommends surface-mount components in 0805 size or smaller in the LMV611-N application circuits. Designers can take advantage of the VSSOP miniature sizes to condense board layout to save space and reduce stray capacitance.

10.2 Layout Example

LMV611 LMV612 LMV614 Layout_3D.png Figure 35. SOT-23 Layout Example