SNOSC69D April   2012  – March 2017 LMV611 , LMV612 , LMV614

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - 1.8 V (DC)
    6. 6.6  Electrical Characteristics - 1.8 V (AC)
    7. 6.7  Electrical Characteristics - 2.7 V (DC)
    8. 6.8  Electrical Characteristics - 2.7 V (AC)
    9. 6.9  Electrical Characteristics - 5 V (DC)
    10. 6.10 Electrical Characteristics - 5 V (AC)
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input and Output Stage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Input Bias Current Consideration
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Half-Wave Rectifier With Rail-to-Ground Output Swing
      2. 8.1.2 Instrumentation Amplifier With Rail-to-Rail Input and Output
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Current Sensing
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Custom Design With WEBENCH® Tools
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (July 2016) to D Revision

  • Added links for WEBENCH Go
  • Changed Slew Rate vs Supply title to reflect LMV611 and LMV614 onlyGo
  • Added Slew Rate vs Supply Graph for LMV612 only Go

Changes from B Revision (March 2013) to C Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed values in the Thermal Information table to align with JEDEC standardsGo

Changes from A Revision (March 2012) to B Revision

  • Changed layout of National Semiconductor data sheet to TI formatGo