SNOS458I April   2000  – June 2016 LMV7219

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics 2.7 V
    6. 6.6 Electrical Characteristics 5 V
    7. 6.7 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Additional Hysteresis
        2. 8.2.2.2 Zero-Crossing Detector
        3. 8.2.2.3 Threshold Detector
        4. 8.2.2.4 Crystal Oscillator
        5. 8.2.2.5 IR Receiver
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Circuit Layout and Bypassing
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)(10)
MIN MAX UNIT
Differential input voltage ± Supply Voltage
Output short circuit duration See(2)
Supply voltage (V+ - V−) 5.5 V
Soldering information     Infrared or Convection (20 sec) 260 °C
Wave Soldering (10 sec) 260 (lead temp) °C
Voltage at input/output pins (V+) + 0.4
(V−) − 0.4		 V
Current at input pin(8) ±10 mA
Maximum junction temperature 150 °C
Storage temperature −65 150 °C

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±150
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±150 V may actually have higher performance.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltages (V+ - V−) 2.7 5 V
Ambient Temperature(3) −40 +85 °C
Junction Temperature 125 °C
PCB Temperature 105 °C

6.4 Thermal Information

THERMAL METRIC(1) LMV7219 LMV7219 UNIT
DBV (SOT23) DCK (SC70)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 209 296 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 170 132 °C/W
RθJB Junction-to-board thermal resistance 68 76 °C/W
ψJT Junction-to-top characterization parameter 52 8.6 °C/W
ψJB Junction-to-board characterization parameter 68 75 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics 2.7 V

Unless otherwise specified, all limits ensured for TJ = 25°C, VCM = V+/2, V+ = 2.7 V, V− = 0 V, CL = 10 pF and RL > 1MΩ to V−.
PARAMETER TEST CONDITIONS MIN TYP(4) MAX(5) UNIT
VOS Input offset voltage 1 6 mV
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 8
IB Input bias current 450 950 nA
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 2000
IOS Input offset current 50 200 nA
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 400
CMRR Common mode rejection ratio 0 V < VCM < 1.50 V 62 85 dB
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 55
PSRR Power supply rejection ratio V+ = 2.7 V to 5 V 65 85 dB
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 55
VCM Input common-voltage range CMRR > 50 dB VCC −1.2 VCC −1 V
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C VCC −1.3
−0.2 −0.1
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 0
VO Output swing high IL = 4 mA,
VID = 500 mV		 VCC −0.3 VCC −0.22 V
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C VCC −0.4
IL = 0.4 mA,
VID = 500 mV		 VCC −0.05 VCC −0.02
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C VCC −0.15
Output swing low IL = −4 mA,
VID = −500 mV		 130 200 mV
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 300
IL = −0.4 mA,
VID = −500 mV		 15 50
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 150
ISC Output short circuit current Sourcing, VO = 0 V(2) 20 mA
Sinking, VO = 2.7 V(2) 20
IS Supply current No Load 0.9 1.6 mA
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 2.2
VHYST Input hysteresis voltage See(9) 7 mV
VTRIP+ Input referred positive trip point (see Figure 19) 3 8 mV
VTRIP− Input referred negative trip point (see Figure 19) −8 −4 mV
tPD Propagation delay Overdrive = 5 mV, VCM = 0V(6) 12 ns
Overdrive = 15 mV, VCM = 0 V(6) 11
Overdrive = 50 mV, VCM = 0 V(6) 10 20
tSKEW Propagation delay skew See(7) 1 ns
tr Output rise time 10% to 90% 2.5 ns
tf Output fall time 90% to 10% 2 ns

6.6 Electrical Characteristics 5 V

Unless otherwise specified, all limits ensured for TJ = 25°C, VCM = V+/2, V+ = 5 V, V− = 0 V, CL = 10 pF and RL > 1 MΩ to V−.
PARAMETER TEST CONDITIONS MIN TYP(4) MAX(5) UNIT
VOS Input offset voltage 1 6 mV
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 8
IB Input bias current 500 950 nA
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 2000
IOS Input offset current 50 200 nA
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 400
CMRR Common mode rejection ratio 0 V < VCM < 3.8 V 65 85 dB
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 55
PSRR Power supply rejection ratio V+ = 2.7 V to 5 V 65 85 dB
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 55
VCM Input common-mode voltage range CMRR > 50 dB VCC −1.2 VCC −1 V
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C VCC −1.3
−0.2 −0.1 V
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 0
VO Output swing high IL = 4 mA,
VID = 500 mV		 VCC −0.2 VCC −0.13 V
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C VCC −0.3
IL = 0.4 mA,
VID = 500 mV		 VCC −0.05 VCC −0.02
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C VCC −0.15
Output swing low IL = −4 mA,
VID = −500 mV		 80 180 mV
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 280
IL = −0.4 mA,
VID = −500 mV		 10 50
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 150
ISC Output short circuit current Sourcing, VO = 0 V(2) 30 68 mA
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 20
Sinking, VO = 5 V(2) 30 65
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 20
IS Supply current No Load 1.1 1.8 mA
−40°C ≤ TJ ≤ +85°C and TPCB ≤ 105°C 2.4
VHYST Input hysteresis voltage See(9) 7.5 mV
VTrip+ Input referred positive trip point (See Figure 19) 3.5 8 mV
VTrip− Input referred negative trip point (See Figure 19) −8 −4 mV
tPD Propagation delay Overdrive = 5 mV, VCM = 0 V(6) 9 ns
Overdrive = 15 mV, VCM = 0 V(6) 8 20
Overdrive = 50 mV, VCM = 0 V(6) 7 19
tSKEW Propagation delay skew See(7) 0.4 ns
tr Output rise time 10% to 90% 1.3 ns
tf Output fall time 90% to 10% 1.25 ns
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical characteristics.
(2) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30mA over long term may adversely affect reliability.
(3) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/RθJA. All numbers apply for packages soldered directly into a PC board.
(4) Typical Values represent the most likely parametric norm.
(5) All limits are specified by testing or statistical analysis.
(6) Propagation delay measurements made with 100 mV steps. Overdrive is measured relative to VTrip.
(7) Propagation Delay Skew is defined as absolute value of the difference between tPDLH and tPDHL.
(8) Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.
(9) The LMV7219 comparator has internal hysteresis. The trip points are the input voltage needed to change the output state in each direction. The offset voltage is defined as the average of Vtrip+ and Vtrip−, while the hysteresis voltage is the difference of these two.
(10) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

6.7 Typical Performance Characteristics

Unless otherwise specified, VS = 5 V, CL = 10 pF, TA = 25°C
LMV7219 10105404.png
Figure 1. Supply Current vs. Supply Voltage
LMV7219 10105406.png
Figure 3. Input Offset and Trip Voltage vs. Supply Voltage
LMV7219 10105409.png
VS = 5 V
Figure 5. Sourcing Current vs. Output Voltage
LMV7219 10105411.png
VS = 5 V
Figure 7. Sinking Current vs. Output Voltage
LMV7219 10105413.png
VS = 5V
VOD = 15 mV
Figure 9. Propagation Delay vs. Temperature
LMV7219 10105415.png
Figure 11. Propagation Delay vs. Input Overdrive
LMV7219 10105405.png
Figure 2. VOS vs. Supply Voltage
LMV7219 10105408.png
VS = 2.7 V
Figure 4. Sourcing Current vs. Output Voltage
LMV7219 10105410.png
VS = 2.7 V
Figure 6. Sinking Current vs. Output Voltage
LMV7219 10105412.png
VS = 2.7 V
VOD = 15 mV
Figure 8. Propagation Delay vs. Temperature
LMV7219 10105414.png
VS = 5 V
VOD = 15 mV
Figure 10. Propagation Delay vs. Capacitive Load
LMV7219 10105416.png
VS = 2.7 V
CL = 10 pF
VOD = 15 mV
Figure 12. Propagation Delay (tPD−)
LMV7219 10105417.png
VS = 2.7 V
CL = 10 pF
VOD = 15 mV
Figure 13. Propagation Delay (tPD+)