SNOSA56I February   2003  – September 2015 LMV7271 , LMV7272 , LMV7275

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  1.8-V Electrical Characteristics
    6. 6.6  1.8-V AC Electrical Characteristics
    7. 6.7  2.7-V Electrical Characteristics
    8. 6.8  2.7-V AC Electrical Characteristics
    9. 6.9  5-V Electrical Characteristics
    10. 6.10 5-V AC Electrical Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Rail-to-Rail Input Stage
      2. 7.3.2 Output Stage, LMV7271 and LMV7272
      3. 7.3.3 Output Stage, LMV7275
    4. 7.4 Device Functional Modes
      1. 7.4.1 Capacitive and Resistive Loads
      2. 7.4.2 Noise
      3. 7.4.3 Hysteresis
        1. 7.4.3.1 Noninverting Comparator With Hysteresis
        2. 7.4.3.2 Inverting Comparator With Hysteresis
      4. 7.4.4 Zero Crossing Detector
        1. 7.4.4.1 Zero Crossing Detector With Hysteresis
      5. 7.4.5 Threshold Detector
      6. 7.4.6 Universal Logic Level Shifter (LMV7275 only)
      7. 7.4.7 OR'ING the Output (LMV7275 only)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Square Wave Oscillator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Positive Peak Detector
      3. 8.2.3 Negative Peak Detector
      4. 8.2.4 Window Detector
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Circuit Techniques for Avoiding Oscillations in Comparator Applications
      2. 10.1.2 DSBGA Light Sensitivity
      3. 10.1.3 DSBGA Mounting
      4. 10.1.4 LMV7272 DSBGA to DIP Conversion Board
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from H Revision (February 2013) to I Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Removed Soldering Information from Absolute Maximum Ratings table Go

Changes from G Revision (February 2013) to H Revision

  • Changed layout of National Data Sheet to TI formatGo