SNOSAT1I October   2006  – October 2017 LMV841 , LMV842 , LMV844

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - 3.3 V
    6. 6.6 Electrical Characteristics - 5 V
    7. 6.7 Electrical Characteristics - ±5-V
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Protection
      2. 7.3.2 Input Stage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Driving Capacitive Load
      2. 7.4.2 Noise Performance
    5. 7.5 Interfacing to High Impedance Sensor
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Active Filter Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 High-Side, Current-Sensing Circuit
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Thermocouple Sensor Signal Amplification
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from H Revision (July 2016) to I Revision

  • Changed ESD Ratings table footnotes to TI standard Go
  • Changed Thermal Information tableGo
  • Changed Phase Margin vs CL graphic Go
  • Changed Overshoot vs CL graphicGo

Changes from G Revision (February 2013) to H Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from F Revision (February 2013) to G Revision

  • Changed layout of National Semiconductor Data Sheet to TI formatGo