SNOSAI3D
October 2006 – September 2015
LMV951
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics: 1 V
6.6
Electrical Characteristics: 1.8 V
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Battery Operated Systems
7.3.2
Small Size
7.4
Device Functional Modes
7.4.1
Shutdown Capability
7.4.2
Rail-to-Rail Input
7.4.3
Rail-to-Rail Output
7.4.4
Driving Capacitive Load
8
Application and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
Two Wire Line Transmission
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curves
8.2.2
Bridge Configuration Amplifier
8.2.3
Virtual Ground Circuit
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Community Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DDC|6
MPDS124I
Thermal pad, mechanical data (Package|Pins)
Orderable Information
snosai3d_oa
snosai3d_pm
10 Layout
10.1 Layout Guidelines
The V+ pin must be bypassed to ground with a low-ESR capacitor. The optimum placement is closest to the V+ and ground pins.
Take care to minimize the loop area formed by the bypass capacitor connection between V+ and ground.
The ground pin should be connected to the PCB ground plane at the pin of the device.
The feedback components should be placed as close to the device as possible minimizing strays.
10.2 Layout Example
Figure 55. Layout Recommendation