SNAS800B July   2021  – February 2024 LMX1204

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
      1. 6.1.1 Range of Dividers and Multiplier
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power On Reset
      2. 6.3.2 Temperature Sensor
      3. 6.3.3 Clock Outputs
        1. 6.3.3.1 Clock Output Buffers
        2. 6.3.3.2 Clock MUX
        3. 6.3.3.3 Clock Divider
        4. 6.3.3.4 Clock Multiplier and Filter Modes
          1. 6.3.3.4.1 General Information About the Clock Multiplier
          2. 6.3.3.4.2 State Machine Clock for the Clock Multiplier
            1. 6.3.3.4.2.1 State Machine Clock
          3. 6.3.3.4.3 Calibration for the Clock Multiplier
          4. 6.3.3.4.4 Using the x1 Clock Multiplier as a Filter
          5. 6.3.3.4.5 Lock Detect for the Clock Multiplier
      4. 6.3.4 Device Functional Modes Configurations
      5. 6.3.5 LOGICLK Output
        1. 6.3.5.1 LOGICLK Output Format
        2. 6.3.5.2 LOGICLK_DIV_PRE and LOGICLK_DIV Dividers
      6. 6.3.6 SYSREF
        1. 6.3.6.1 SYSREF Output Buffers
          1. 6.3.6.1.1 SYSREF Output Buffers for Main Clocks (SYSREFOUT)
          2. 6.3.6.1.2 SYSREF Output Buffer for LOGICLK
        2. 6.3.6.2 SYSREF Frequency and Delay Generation
        3. 6.3.6.3 SYSREFREQ pins and SYSREFREQ_SPI Field
          1. 6.3.6.3.1 SYSREFREQ Pins Common-Mode Voltage
          2. 6.3.6.3.2 SYSREFREQ Windowing Feature
            1. 6.3.6.3.2.1 General Procedure Flowchart for SYSREF Windowing Operation
            2. 6.3.6.3.2.2 SYSREFREQ Repeater Mode With Delay Gen (Retime)
      7. 6.3.7 SYNC Feature
    4. 6.4 Device Functional Modes
  8. Register Map
    1. 7.1 LMX1204 Registers
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 SYSREFREQ Input Configuration
      2. 8.1.2 Reducing SYSREF Common Mode Voltages
      3. 8.1.3 Current Consumption
      4. 8.1.4 Treatment of Unused Pins
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

GUID-20220715-SS0I-7SX0-3PGT-SDBHSXCG0VHB-low.svg
Noise Floor = –161 dBc/Hz, 1/f Noise = –154 dBc/Hz @ 10 kHz, Integrates to 28 fs jitter from 100 Hz to 6 GHz offset
Figure 5-2 Buffer Phase Noise Plot at 6 GHz Output
GUID-20220715-SS0I-WCQL-NPK0-JDQJLPXJNXFH-low.svg
Noise Floor = –160.5 dBc/Hz, 1/f Noise = –154 dBc/Hz @ 10 kHz, Integrates to 30 fs jitter from 100 Hz to 6 GHz offset
Figure 5-4 Divide by 2 Phase Noise Plot at 6 GHz Output
GUID-20220715-SS0I-FRTR-FK4X-JHWG3CMJJFLP-low.svgFigure 5-6 Multiplier Phase Noise Plot at 6 GHz Output
GUID-20220727-SS0I-4LD5-W5QR-ZGCDFJLSJFLS-low.svgFigure 5-8 Noise Floor in Buffer Mode
GUID-20220805-SS0I-BTZ2-TXMZ-WJSD0KDSDMD8-low.svgFigure 5-10 Noise Floor in Divide by 2 Mode
GUID-20220805-SS0I-JNNK-MQCD-HGLGDVNWSNM5-low.svg
Applies to all modes except divider mode with odd divide (which has slightly lower power).
Figure 5-12 Single-Ended Output Power
GUID-20220805-SS0I-Q3WH-GHQ3-N391HLN66FNM-low.svg
Note: CLKOUTx_PWR=7
Figure 5-14 CLKOUT Waveform at 1 GHz
GUID-20220802-SS0I-BTZR-KLL5-4TPMT9BJQJCB-low.svgFigure 5-16 Second Harmonic in Buffer Mode
GUID-20220802-SS0I-KN7J-GVKM-QXS3DG537TZZ-low.svgFigure 5-18 Second Harmonic in Divide by 2 Mode (Single-Ended)
GUID-20220802-SS0I-QMQD-PHFH-7LDSNGJBDQNG-low.svg
Note: Output is differential.
Figure 5-20 Multiplier Sub-Harmonics (Harmonic Frequency = Output Frequency / M )
GUID-20220802-SS0I-NFRK-2HQ6-XDWJGKQ6PQS1-low.svgFigure 5-22 Multiplier Intermodulation Spur (MULT=2)
GUID-20220805-SS0I-LJSQ-VRSM-2MCW1NR2FBXT-low.svg
Measured in power-down mode to make Junction Temperature = Ambient temperature.
Figure 5-24 Temperature Sensor Readback
GUID-20220804-SS0I-WKNZ-KBL2-PDJMHMS5TPFS-low.svg
Figure 5-26 Output to Output Skew
GUID-20220805-SS0I-WVPN-TPPM-RPZHJD4SMDSK-low.svgFigure 5-28 SYSREF Delay vs. Temperature and Code (Fout = 10 GHz)
GUID-20220805-SS0I-FR5M-DSQC-L10XQPKLJFQS-low.svgFigure 5-30 CLKIN S11 Magnitude
GUID-20220718-SS0I-M2HZ-WDRZ-3BGHHHS2RCJX-low.svg
Stated input power is applied at each pin.
Figure 5-3 Noise Floor in Buffer Mode
GUID-20220805-SS0I-26XH-T6V3-CJB04VBBDWB5-low.svg
Stated input power is applied at each pin.
Figure 5-5 Noise Floor With Divide by 2
GUID-20220718-SS0I-2PKM-MQPX-RGFFJKQMLVSL-low.svg
Note: Input power in graph is differential.
Figure 5-7 Noise Floor in Multiply x2 Mode
GUID-20220718-SS0I-RBL2-HRGZ-W6LFLZTNJDFZ-low.svgFigure 5-9 Noise Floor in x2 Multiplier Mode
GUID-20220805-SS0I-XSB6-STHN-NJNL6DL7JMR7-low.svgFigure 5-11 Noise Floor in Divider Mode
GUID-20220805-SS0I-4NNH-KGCJ-VCD7MS9DS4JC-low.svg
CLKOUTx_PWR = 7
Figure 5-13 Single-Ended Output Power
GUID-20220805-SS0I-5CLF-5GT3-0JSRQN2FFVCF-low.svg
Note: CLKOUTx_PWR=7
Figure 5-15 CLKOUT Waveform at 3 GHz
GUID-20210505-CA0I-PB4Q-VB25-RN0WZ7FWPRMW-low.svgFigure 5-17 Second Harmonic in Divide Mode (Single-Ended)
GUID-20220718-SS0I-DSGX-TXRJ-F82XNVBNH6RD-low.svgFigure 5-19 Second Harmonic in Multiply X2 Mode (Differential)
GUID-20220802-SS0I-BBZR-DBKH-G457KPNC4JNJ-low.svgFigure 5-21 Multiplier 1/2 Sub-Harmonic in X2 Mode
GUID-20220802-SS0I-VPG1-P7Q0-NFKR5BBVBZZB-low.svgFigure 5-23 Multiplier Intermodulation (M+1)/M Spur
GUID-20220728-SS0I-L4DR-B8NR-R1NLHDRCSTXD-low.svg
Over 30 devices and 3 corner lots, propagation delay varied 1.1 ps over process and 7 ps overall when the temperature is held at a constant 25°C.
Figure 5-25 Propagation Delay
GUID-20220804-SS0I-MQ3R-XJRQ-KK2FNRF5HTL5-low.svg
Main source of skew variation is frequency and measurement error. Other observed sources of variation include about 3 ps over process corners and 1.5 ps over temperature.
Figure 5-27 Output to Output Skew Variation for CLKOUT0 to CLKout3
GUID-20220805-SS0I-NZC5-XFZ1-SLLJW2CSTB7D-low.svgFigure 5-29 SYSREF Delta Delay vs. Temperature and Code (Fout=10 GHz)
GUID-20220805-SS0I-0WFN-1D6S-C372TDKK65J8-low.svgFigure 5-31 CLKIN S11 Phase