SNAS800B
July 2021 – February 2024
LMX1204
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Timing Requirements
5.7
Timing Diagram
5.8
Typical Characteristics
6
Detailed Description
6.1
Overview
6.1.1
Range of Dividers and Multiplier
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Power On Reset
6.3.2
Temperature Sensor
6.3.3
Clock Outputs
6.3.3.1
Clock Output Buffers
6.3.3.2
Clock MUX
6.3.3.3
Clock Divider
6.3.3.4
Clock Multiplier and Filter Modes
6.3.3.4.1
General Information About the Clock Multiplier
6.3.3.4.2
State Machine Clock for the Clock Multiplier
6.3.3.4.2.1
State Machine Clock
6.3.3.4.3
Calibration for the Clock Multiplier
6.3.3.4.4
Using the x1 Clock Multiplier as a Filter
6.3.3.4.5
Lock Detect for the Clock Multiplier
6.3.4
Device Functional Modes Configurations
6.3.5
LOGICLK Output
6.3.5.1
LOGICLK Output Format
6.3.5.2
LOGICLK_DIV_PRE and LOGICLK_DIV Dividers
6.3.6
SYSREF
6.3.6.1
SYSREF Output Buffers
6.3.6.1.1
SYSREF Output Buffers for Main Clocks (SYSREFOUT)
6.3.6.1.2
SYSREF Output Buffer for LOGICLK
6.3.6.2
SYSREF Frequency and Delay Generation
6.3.6.3
SYSREFREQ pins and SYSREFREQ_SPI Field
6.3.6.3.1
SYSREFREQ Pins Common-Mode Voltage
6.3.6.3.2
SYSREFREQ Windowing Feature
6.3.6.3.2.1
General Procedure Flowchart for SYSREF Windowing Operation
6.3.6.3.2.2
SYSREFREQ Repeater Mode With Delay Gen (Retime)
6.3.7
SYNC Feature
6.4
Device Functional Modes
7
Register Map
7.1
LMX1204 Registers
8
Application and Implementation
8.1
Application Information
8.1.1
SYSREFREQ Input Configuration
8.1.2
Reducing SYSREF Common Mode Voltages
8.1.3
Current Consumption
8.1.4
Treatment of Unused Pins
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Device Support
9.2
Documentation Support
9.2.1
Related Documentation
9.3
Receiving Notification of Documentation Updates
9.4
Support Resources
9.5
Trademarks
9.6
Electrostatic Discharge Caution
9.7
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RHA|40
MPQF135D
Thermal pad, mechanical data (Package|Pins)
RHA|40
QFND650
Orderable Information
snas800b_oa
snas800b_pm
5
Specifications