SNAS866A December   2023  – September 2024 LMX1214

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
      1. 6.1.1 Range of Dividers
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power-On Reset
      2. 6.3.2 Temperature Sensor
      3. 6.3.3 Clock Outputs
        1. 6.3.3.1 Clock Output Buffers
        2. 6.3.3.2 Clock MUX
        3. 6.3.3.3 Clock Divider
      4. 6.3.4 AUXCLK Output
        1. 6.3.4.1 AUXCLKOUT Output Format
        2. 6.3.4.2 AUXCLK_DIV_PRE and AUXCLK_DIV Dividers
      5. 6.3.5 SYNC Input Pins
        1. 6.3.5.1 SYNC Pins Common-Mode Voltage
        2. 6.3.5.2 Windowing Feature
    4. 6.4 Device Functional Modes Configurations
      1. 6.4.1 Pin Mode Control
  8. 7 Register Map
    1. 7.1 Device Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 SYNC Input Configuration
      2. 8.1.2 Treatment of Unused Pins
      3. 8.1.3 Current Consumption
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.8 Typical Characteristics

If not otherwise, the following conditions can be assumed: Temperature = 25°C, Vcc = 2.5 V, OUTx_PWR = 7, CLKIN driven differentially with 8 dBm at each pin. Signal source used is SMA100B with ultra-low noise option B711.
LMX1214 Buffer Phase Noise Plot at 6-GHz Output
Noise floor = -160dBc/Hz
Figure 5-2 Buffer Phase Noise Plot at 6-GHz Output
LMX1214 LMX1214 Flicker Noise at 6 GHz
Figure 5-4 LMX1214 Flicker Noise at 6 GHz
LMX1214 Noise Floor in Divider ModeFigure 5-6 Noise Floor in Divider Mode
LMX1214 Buffer Mode Single-Ended Output Power Over Temperature
Figure 5-8 Buffer Mode Single-Ended Output Power Over Temperature
LMX1214 Second Harmonic in Buffer Mode
Figure 5-10 Second Harmonic in Buffer Mode
LMX1214 Output to Output Skew
Figure 5-12 Output to Output Skew
LMX1214 Channel Enable Setting Time
at 300-MHz Output Frequency
Figure 5-14 Channel Enable Setting Time
LMX1214 Buffer Output Phase Noise Plots vs Output Frequencies
Source noise is not de-embedded.
Figure 5-3 Buffer Output Phase Noise Plots vs Output Frequencies
LMX1214 Noise Floor in Buffer Mode
Figure 5-5 Noise Floor in Buffer Mode
LMX1214 Buffer Mode Single-Ended Output Power vs Input Power
Figure 5-7 Buffer Mode Single-Ended Output Power vs Input Power
LMX1214 Buffer Mode Single-Ended Output Power vs Power Codes
Applies to all modes except divider mode with odd divide (which have slightly lower power).
Figure 5-9 Buffer Mode Single-Ended Output Power vs Power Codes
LMX1214 Second Harmonic in Divider Mode
Single-Ended Input Power
Figure 5-11 Second Harmonic in Divider Mode
LMX1214 Temperature Sensor Readback
Measured in power-down mode to make Junction Temperature = Ambient Temperature. 
Figure 5-13 Temperature Sensor Readback
LMX1214 Channel Disable Setting Time
at 300-MHz Output Frequency
Figure 5-15 Channel Disable Setting Time