SNAS883 June   2024 LMX1860-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
      1. 6.1.1 Range of Dividers and Multiplier
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power On Reset
      2. 6.3.2 Temperature Sensor
      3. 6.3.3 Clock Outputs
        1. 6.3.3.1 Clock Output Buffers
        2. 6.3.3.2 Clock MUX
        3. 6.3.3.3 Clock Divider
        4. 6.3.3.4 Clock Multiplier
          1. 6.3.3.4.1 General Information about the Clock Multiplier
          2. 6.3.3.4.2 State Machine Clock for the Clock Multiplier
            1. 6.3.3.4.2.1 State Machine Clock
          3. 6.3.3.4.3 Calibration for the Clock Multiplier
          4. 6.3.3.4.4 Lock Detect for the Clock Multiplier
          5. 6.3.3.4.5 Watchdog Timer
      4. 6.3.4 Device Functional Modes Configurations
      5. 6.3.5 LOGICLK Output
        1. 6.3.5.1 LOGICLK Output Format
        2. 6.3.5.2 LOGICLK_DIV_PRE and LOGICLK_DIV Dividers
      6. 6.3.6 SYSREF
        1. 6.3.6.1 SYSREF Output Buffers
          1. 6.3.6.1.1 SYSREF Output Buffers for Main Clocks (SYSREFOUT)
          2. 6.3.6.1.2 SYSREF Output Buffer for LOGICLK
        2. 6.3.6.2 SYSREF Frequency and Delay Generation
        3. 6.3.6.3 SYSREFREQ Pins and SYSREFREQ_FORCE Field
          1. 6.3.6.3.1 SYSREFREQ Pins Common-Mode Voltage
          2. 6.3.6.3.2 SYSREFREQ Windowing Feature
            1. 6.3.6.3.2.1 General Procedure Flowchart for SYSREF Windowing Operation
            2. 6.3.6.3.2.2 SYSREFREQ Repeater Mode With Delay Generation (Retime)
            3. 6.3.6.3.2.3 Other Guidance For SYSREF Windowing
            4. 6.3.6.3.2.4 For Glitch-Free Output
            5. 6.3.6.3.2.5 If Using SYNC Feature
          3. 6.3.6.3.3 SYNC Feature
      7. 6.3.7 Pin Mode Control
        1. 6.3.7.1 Chip Enable (CE)
        2. 6.3.7.2 Output Channel Control
        3. 6.3.7.3 Logic Output Control
        4. 6.3.7.4 SYSREF Output Control
        5. 6.3.7.5 Device Mode Selection
        6. 6.3.7.6 Divider or Multiplier Value Selection
        7. 6.3.7.7 Calibration Control Pin
        8. 6.3.7.8 Output Power Control
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 SYSREFREQ Input Configuration
      2. 7.1.2 Treatment of Unused Pins
      3. 7.1.3 Current Consumption
    2. 7.2 Typical Applications
      1. 7.2.1 Local Oscillator Distribution Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Plot
      2. 7.2.2 JESD204B/C Clock Distribution Application
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
    4. 7.4 Power Supply Recommendations
      1. 7.4.1 Power-Up Timing
    5. 7.5 Register Map
      1. 7.5.1 Device Registers
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.1 Layout Guidelines

  • If using a single-ended output, terminate the complementary side with 50Ω so that the impedance for the signal output is same as complementary pin side.
  • GND pins on the outer perimeter of the package can be routed on the package back to the DAP.
  • Minimize the length of the CLKIN trace for optimal phase noise. Poor matching can degrade the noise floor.
  • Verify that the DAP on the device is well-grounded with many vias.
  • Use a low loss dielectric material, such as Rogers 4003C, for optimal output power.
  • Be aware that if all the outputs and SYSREF are operating, the current consumption can be high enough to exceed the recommended internal junction temperature of 125°C; a heat sink can be necessary.