SNAS711A October   2016  – January 2017 LMX2491

PRODUCTION DATA.  

  1. 1 Features
  2. 2  Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Storage Conditions
    3. 6.3 ESD Ratings
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Requirements, Programming Interface (CLK, DATA, LE)
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  OSCin Input
      2. 7.3.2  OSCin Doubler
      3. 7.3.3  R Divider
      4. 7.3.4  PLL N Divider
      5. 7.3.5  Fractional Circuitry
      6. 7.3.6  PLL Phase Detector and Charge Pump
      7. 7.3.7  External Loop Filter
      8. 7.3.8  Fastlock and Cycle Slip Reduction
      9. 7.3.9  Lock Detect and Charge Pump Voltage Monitor
        1. 7.3.9.1 Charge Pump Voltage Monitor
        2. 7.3.9.2 Digital Lock Detect
      10. 7.3.10 FSK/PSK Modulation
      11. 7.3.11 Ramping Functions
        1. 7.3.11.1 Ramp Count
        2. 7.3.11.2 Ramp Comparators and Ramp Limits
      12. 7.3.12 Power-on-reset (POR)
      13. 7.3.13 Register Readback
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Frequency Generator
        1. 7.4.1.1 Integer Mode Operation
        2. 7.4.1.2 Fractional Mode Operation
      2. 7.4.2 Modulated Waveform Generator
    5. 7.5 Programming
      1. 7.5.1 Loading Registers
    6. 7.6 Register Maps
      1. 7.6.1 Register Field Descriptions
        1. 7.6.1.1 POWERDOWN and Reset Fields
        2. 7.6.1.2 Dividers and Fractional Controls
          1. 7.6.1.2.1 Speed Up Controls (Cycle Slip Reduction and Fastlock)
      2. 7.6.2 Lock Detect and Charge Pump Monitoring
      3. 7.6.3 TRIG1, TRIG2, MOD, and MUXout Pins
      4. 7.6.4 Ramping Functions
      5. 7.6.5 Individual Ramp Controls
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1  Design Requirements
      2. 8.2.2  Detailed Design Procedure
      3. 8.2.3  TICS Pro Basic Setup
      4. 8.2.4  Frequency Shift Keying Example
      5. 8.2.5  Single Sawtooth Ramp Example
      6. 8.2.6  Continuous Sawtooth Ramp Example
      7. 8.2.7  Continuous Sawtooth Ramp with FSK Example
      8. 8.2.8  Continuous Triangular Ramp Example
      9. 8.2.9  Continuous Trapezoid Ramp Example
      10. 8.2.10 Arbitrary Waveform Ramp Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

Texas Instruments has several software tools to aid in the development process including TICS Pro for programming, PLLatinum Simulator Tool for loop filter design and phase noise/spur simulation. All these tools are available at www.ti.com.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation, see the following:

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.