SNAS252S October   2005  – December 2014 LMX2531

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 MICROWIRE Timing Requirements
    7. 6.7 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Reference Oscillator Input
      2. 7.3.2 R Divider
      3. 7.3.3 Phase Detector and Charge Pump
      4. 7.3.4 N Divider and Fractional Circuitry
      5. 7.3.5 Partially Integrated Loop Filter
      6. 7.3.6 Low Noise, Fully Integrated VCO
      7. 7.3.7 Programmable VCO Divider
      8. 7.3.8 Serial Data Timing Requirements
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1 General Programming Information
        1. 7.6.1.1  Initialization Sequence
        2. 7.6.1.2  Complete Register Content Map
        3. 7.6.1.3  Register R0
          1. 7.6.1.3.1 NUM[10:0] and NUM[21:12] -- Fractional Numerator
          2. 7.6.1.3.2 N[7:0] and N[10:8]
        4. 7.6.1.4  Register R1
          1. 7.6.1.4.1 NUM[21:12]
          2. 7.6.1.4.2 N[10:8] -- 3 MSB Bits for the N Counter
          3. 7.6.1.4.3 ICP[3:0] -- Charge Pump Current
        5. 7.6.1.5  Register R2
          1. 7.6.1.5.1 R[5:0] -- R Counter Value
          2. 7.6.1.5.2 DEN[21:12] and DEN[11:0]-- Fractional Denominator
        6. 7.6.1.6  Register R3
          1. 7.6.1.6.1 DEN[21:12] -- Extension for the Fractional Denominator
          2. 7.6.1.6.2 FoLD[3:0] -- Multiplexed Output for Ftest/LD Pin
          3. 7.6.1.6.3 ORDER -- Order of Delta-Sigma Modulator
          4. 7.6.1.6.4 DITHER -- Dithering
          5. 7.6.1.6.5 FDM -- Fractional Denominator Mode
          6. 7.6.1.6.6 DIV2
        7. 7.6.1.7  Register R4
          1. 7.6.1.7.1 TOC[13:0] -- Time-Out Counter for FastLock
          2. 7.6.1.7.2 ICPFL[3:0] -- Charge Pump Current for Fastlock
        8. 7.6.1.8  Register R5
          1. 7.6.1.8.1 EN_PLL -- Enable Bit for PLL
          2. 7.6.1.8.2 EN_VCO -- Enable Bit for the VCO
          3. 7.6.1.8.3 EN_OSC -- Enable Bit for the Oscillator Inverter
          4. 7.6.1.8.4 EN_VCOLDO -- Enable Bit for the VCO LDO
          5. 7.6.1.8.5 EN_PLLLDO1 -- Enable Bit for the PLL LDO 1
          6. 7.6.1.8.6 EN_PLLLDO2 -- Enable Bit for the PLL LDO 2
          7. 7.6.1.8.7 EN_DIGLDO -- Enable Bit for the digital LDO
          8. 7.6.1.8.8 REG_RST -- Resets All Registers to Default Settings
        9. 7.6.1.9  Register R6
          1. 7.6.1.9.1 C3_C4_ADJ[2:0] -- Value FOR C3 and C4 In The Internal Loop Filter
          2. 7.6.1.9.2 R3_ADJ_FL[1:0] -- Value for Internal Loop Filter Resistor R3 During Fastlock
          3. 7.6.1.9.3 R3_ADJ[1:0] -- Value for Internal Loop Filter Resistor R3
          4. 7.6.1.9.4 R4_ADJ_FL[1:0] -- Value for Internal Loop Filter Resistor R4 During Fastlock
          5. 7.6.1.9.5 R4_ADJ[1:0] -- Value for Internal Loop Filter Resistor R4
          6. 7.6.1.9.6 EN_LPFLTR-- Enable for Partially Integrated Internal Loop Filter
          7. 7.6.1.9.7 VCO_ACI_SEL
          8. 7.6.1.9.8 XTLSEL[2:0] -- OSCin Select
        10. 7.6.1.10 Register R7
          1. 7.6.1.10.1 XTLDIV[1:0] -- Division Ratio for the OSCin Frequency
          2. 7.6.1.10.2 XTLMAN[11:0] -- Manual OSCin Mode
        11. 7.6.1.11 Register R8
          1. 7.6.1.11.1 XTLMAN2 -- Manual Crystal Mode Second Adjustment
          2. 7.6.1.11.2 LOCKMODE -- Frequency Calibration Mode
        12. 7.6.1.12 Register R9
        13. 7.6.1.13 Register R12
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Typical Connection Diagram
        1. 10.1.1.1 VccDIG, VccVCO, VccBUF, and VccPLL
        2. 10.1.1.2 VregDIG
        3. 10.1.1.3 VrefVCO
        4. 10.1.1.4 VregVCO
        5. 10.1.1.5 VregPLL1VregPLL2
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed.

TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products

Applications

TI E2E Community : e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright© 2014, Texas Instruments Incorporated