SNAS646G December   2015  – August 2022 LMX2592

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Functional Description
      1. 7.3.1  Input Signal
      2. 7.3.2  Input Signal Path
      3. 7.3.3  PLL Phase Detector and Charge Pump
      4. 7.3.4  N Divider and Fractional Circuitry
      5. 7.3.5  Voltage Controlled Oscillator
      6. 7.3.6  VCO Calibration
      7. 7.3.7  VCO Doubler
      8. 7.3.8  Channel Divider
      9. 7.3.9  Output Distribution
      10. 7.3.10 Output Buffer
      11. 7.3.11 Phase Adjust
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down
      2. 7.4.2 Lock Detect
      3. 7.4.3 Register Readback
    5. 7.5 Programming
      1. 7.5.1 Recommended Initial Power on Programming Sequence
      2. 7.5.2 Recommended Sequence for Changing Frequencies
    6. 7.6 Register Maps
      1. 7.6.1 LMX2592 Register Map – Default Values
        1. 7.6.1.1 Register Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Optimization of Spurs
        1. 8.1.1.1 Understanding Spurs by Offsets
        2. 8.1.1.2 Spur Mitigation Techniques
      2. 8.1.2  Configuring the Input Signal Path
        1. 8.1.2.1 Input Signal Noise Scaling
      3. 8.1.3  Input Pin Configuration
      4. 8.1.4  Using the OSCin Doubler
      5. 8.1.5  Using the Input Signal Path Components
        1. 8.1.5.1 Moving Phase Detector Frequency
        2. 8.1.5.2 Multiplying and Dividing by the Same Value
      6. 8.1.6  Designing for Output Power
      7. 8.1.7  Current Consumption Management
      8. 8.1.8  Decreasing Lock Time
      9. 8.1.9  Modeling and Understanding PLL FOM and Flicker Noise
      10. 8.1.10 External Loop Filter
    2. 8.2 Typical Application
      1. 8.2.1 Design for Low Jitter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHA|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.10 Output Buffer

Each output buffer (A and B) have programmable gain with register OUTA_POW and OUTB_POW. The RF output buffer configuration is open-collector and requires an external pullup from RFout pin to VCC. There are two pullup options that can be used with either resistor or inductor. Refer to the Section 8 section for design considerations.

  1. Resistor pullup: placing a 50-Ω resistor pullup matches the output impedance to 50-Ω. However, maximum output power is limited. Output buffer current settings should be set to a value before output power is saturated (output power increases less for every step increase in output current value).
  2. Inductor pullup: placing an inductor pullup creates a resonance at the frequency of interest. This offers higher output power for the same current and higher maximum output power. However, the output impedance is higher and additional matching may be required..