SNAS788C November 2019 – March 2022 LMX2694-SEP
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | LMX2694-EP | UNIT | |
---|---|---|---|
RTC (VQFN) | |||
48 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 22.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 10.0 | °C/W |
RθJB | Junction-to-board thermal resistance | 6.1 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.1 | °C/W |
ΨJB | Junction-to-board characterization parameter | 6.0 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.7 | °C/W |