SNAS783C June   2020  – February 2021 LMX2820

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Reference Oscillator Input
      2. 7.3.2  Input Path
        1. 7.3.2.1 Input Path Doubler (OSC_2X)
        2. 7.3.2.2 Pre-R Divider (PLL_R_PRE)
        3. 7.3.2.3 Programmable Input Multiplier (MULT)
        4. 7.3.2.4 R Divider (PLL_R)
      3. 7.3.3  PLL Phase Detector and Charge Pump
      4. 7.3.4  N Divider and Fractional Circuitry
        1. 7.3.4.1 Integer N Divide Portion (PLL_N)
        2. 7.3.4.2 Fractional N Divide Portion (PLL_NUM and PLL_DEN)
        3. 7.3.4.3 Modulator Order (MASH_ORDER)
      5. 7.3.5  LD Pin Lock Detect
      6. 7.3.6  MUXOUT Pin and Readback
      7. 7.3.7  Internal VCO
        1. 7.3.7.1 VCO Calibration
          1. 7.3.7.1.1 Determining the VCO Gain and Ranges
      8. 7.3.8  Channel Divider
      9. 7.3.9  Output Frequency Doubler
      10. 7.3.10 Output Buffer
      11. 7.3.11 Power-Down Modes
      12. 7.3.12 Phase Synchronization for Multiple Devices
        1. 7.3.12.1 SYNC Categories
        2. 7.3.12.2 Phase Adjust
          1. 7.3.12.2.1 Using MASH_SEED to Create a Phase Shift
          2. 7.3.12.2.2 Static vs. Dynamic Phase Adjust
          3. 7.3.12.2.3 Fine Adjustments to Phase Adjust
      13. 7.3.13 SYSREF
      14. 7.3.14 Fast VCO Calibration
      15. 7.3.15 Double Buffering (Shadow Registers)
      16. 7.3.16 Output Mute Pin and Ping Pong Approaches
    4. 7.4 Device Functional Modes
      1. 7.4.1 External VCO Mode
      2. 7.4.2 External Feedback Input Pins
        1. 7.4.2.1 PFDIN External Feedback Mode
        2. 7.4.2.2 RFIN External Feedback Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Treatment of Unused Pins
      2. 8.1.2 External Loop Filter
      3. 8.1.3 Using Instant Calibration
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Initialization and Power-on Sequencing
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.