SNVS723H October   2011  – October 2023 LMZ10500

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Start-up Behavior and Soft Start
      3. 7.3.3 Output Short Circuit Protection
      4. 7.3.4 Thermal Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Circuit Operation
      2. 7.4.2 Input Undervoltage Detection
      3. 7.4.3 Shutdown Mode
      4. 7.4.4 EN Pin Operation
      5. 7.4.5 Internal Synchronous Rectification
      6. 7.4.6 High Duty Cycle Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Setting the Output Voltage
          1. 8.2.2.2.1 RT and RB Selection for Fixed VOUT
          2. 8.2.2.2.2 Output Voltage Accuracy Optimization
        3. 8.2.2.3 Dynamic Output Voltage Scaling
        4. 8.2.2.4 Integrated Inductor
        5. 8.2.2.5 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
        1. 8.2.3.1 VOUT = 1.2 V
        2. 8.2.3.2 VOUT = 1.8 V
        3. 8.2.3.3 VOUT = 2.5 V
        4. 8.2.3.4 VOUT = 3.3 V
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Voltage Range
      2. 8.3.2 Current Capability
      3. 8.3.3 Input Connection
        1. 8.3.3.1 Voltage Drops
        2. 8.3.3.2 Stability
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Package Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIL|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 System Characteristics

The following specifications are specified by design providing the component values in Figure 8-1 are used (CIN = COUT = 10 µF, 6.3 V, 0603, TDK C1608X5R0J106K). These parameters are not specified by production testing. Unless otherwise stated the following conditions apply: TA = 25°C.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ΔVOUT/VOUTOutput Voltage Regulation Over Line Voltage and Load CurrentVOUT = 0.6 V
ΔVIN =2.7 V to 4.2 V
ΔIOUT = 0 A to 650 mA		±1.23%
ΔVOUT/VOUTOutput Voltage Regulation Over Line Voltage and Load CurrentVOUT = 1.5 V
ΔVIN = 2.7 V to 5.5 V
ΔIOUT = 0 A to 650 mA		±0.56%
ΔVOUT/VOUTOutput Voltage Regulation Over Line Voltage and Load CurrentVOUT = 3.6 V
ΔVIN = 4.0 V to 5.5 V
ΔIOUT = 0 A to 650 mA		±0.24%
VREF TRISERise time of reference voltageEN = Low to High, VIN = 4.2 V
VOUT = 2.7 V, IOUT = 650 mA		10µs
ηPeak EfficiencyVIN = 5.0 V, VOUT = 3.3 V
IOUT = 200 mA		95%
Full Load EfficiencyVIN = 5.0 V, VOUT = 3.6 V
IOUT = 650 mA		93%
VOUT RippleOutput voltage rippleVIN = 5.0 V, VOUT = 1.8 V
IOUT = 650 mA (1)		8mV pk-pk
Line TransientLine transient responseVIN = 2.7 V to 5.5 V,
TR = TF= 10 µs,
VOUT = 1.8 V, IOUT = 650 mA		25mV pk-pk
Load TransientLoad transient responseVIN = 5.0 V
TR = TF = 40 µs,
VOUT = 1.8 V
IOUT = 65 mA to 650 mA		25mV pk-pk
(1) Ripple voltage must be measured across COUT on a well-designed PC board using the suggested capacitors.