SNVS690I January 2011 – August 2021 LMZ14201H
PRODUCTION DATA
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 Design Steps for the LMZ14201H Application
- 8.2.3 Application Curve
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
- NDW|7
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6.6 Typical Characteristics
Unless otherwise specified, the following conditions apply: VIN = 24 V; Cin = 10-uF X7R Ceramic; CO = 47 uF; TA = 25°C.
Figure 6-1 Efficiency VOUT = 5 V, TA = 25°C
Figure 6-3 Efficiency VOUT = 12 V, TA = 25°C
Figure 6-5 Efficiency VOUT = 15 V, TA = 25°C
Figure 6-7 Efficiency VOUT = 18 V, TA = 25°C
Figure 6-9 Efficiency VOUT = 24 V, TA = 25°C
Figure 6-11 Efficiency VOUT = 30 V, TA = 25°C
Figure 6-13 Efficiency VOUT = 5 V, TA = 85°C
Figure 6-15 Efficiency VOUT = 12 V, TA = 85°C
Figure 6-17 Efficiency VOUT = 15 V, TA = 85°C
Figure 6-19 Efficiency VOUT = 18 V, TA = 85°C
Figure 6-21 Efficiency VOUT = 24 V, TA = 85°C
Figure 6-23 Efficiency VOUT = 30 V, TA = 85°C
Figure 6-25 Thermal Derating VOUT = 12 V, RθJA = 16°C/W
Figure 6-27 Thermal Derating VOUT = 24 V, RθJA = 16°C/W
Figure 6-29 Thermal Derating VOUT = 30 V, RθJA = 16°C/W
Figure 6-31 Package Thermal Resistance RθJA 4 Layer PCB With 1-oz Copper
Figure 6-33 Output Ripple VIN = 12 V, IOUT = 1 A, Ceramic COUT, BW = 200 MHz
Figure 6-35 Load Transient Response VIN = 24 V VOUT = 12 V Load Step from 10% to 100%
Figure 6-37 Current Limit vs. Input Voltage VOUT = 5 V
Figure 6-39 Current Limit vs. Input Voltage VOUT = 12 V
Figure 6-41 Current Limit vs. Input Voltage VOUT = 24 V
Figure 6-43 Start-Up VIN = 24 V, IOUT = 1 A
Figure 6-45 Conducted EMI, VOUT = 12 V Evaluation Board BOM and 3.3-µH, 1-µF LC Line Filter
Figure 6-2 Power
Dissipation VOUT = 5 V, TA = 25°C
Figure 6-4 Power
Dissipation VOUT = 12 V, TA = 25°C
Figure 6-6 Power
Dissipation VOUT = 15 V, TA = 25°C
Figure 6-8 Power Dissipation VOUT = 18 V, TA = 25°C
Figure 6-10 Power Dissipation VOUT = 24 V, TA = 25°C
Figure 6-12 Power Dissipation VOUT = 30 V, TA = 25°C
Figure 6-14 Power Dissipation VOUT = 5 V, TA = 85°C
Figure 6-16 Power Dissipation VOUT = 12 V, TA = 85°C
Figure 6-18 Power Dissipation VOUT = 15 V, TA = 85°C
Figure 6-20 Power Dissipation VOUT = 18 V, TA = 85°C
Figure 6-22 Power Dissipation VOUT = 24 V, TA = 85°C
Figure 6-24 Power Dissipation VOUT = 30 V, TA = 85°C
Figure 6-26 Thermal Derating VOUT = 12 V, RθJA = 20°C/W
Figure 6-28 Thermal Derating VOUT = 24 V, RθJA = 20°C/W
Figure 6-30 Thermal Derating VOUT = 30 V, RθJA = 20°C/W
Figure 6-32 Line and Load Regulation TA = 25°C
Figure 6-34 Output Ripple VIN = 24 V, IOUT = 1 A, Polymer Electrolytic COUT, BW = 200 MHz
Figure 6-36 Load Transient Response VIN = 24 V VOUT = 12 V Load Step From 30% to 100%
Figure 6-38 Switching Frequency vs. Power Dissipation VOUT = 5 V
Figure 6-40 Switching Frequency vs. Power Dissipation VOUT = 12 V
Figure 6-42 Switching Frequency vs. Power Dissipation VOUT = 24 V
Figure 6-44 Radiated EMI of Evaluation Board, VOUT = 12 V