SNVS874E August 2012 – September 2021 LMZ20501
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | LMZ20501 | UNIT | |
---|---|---|---|
USIP (SIL) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 42.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 20.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 9.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 1.5 | °C/W |
ψJB | Junction-to-board characterization parameter | 9.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.8 | °C/W |