SNVS872D August   2012  – August 2018 LMZ21700

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency for VIN = 12 V
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 Package Construction
    3. 7.3 Feature Description
      1. 7.3.1 Input Undervoltage Lockout
      2. 7.3.2 Enable Input (EN)
      3. 7.3.3 Soft-Start and Tracking Function (SS)
      4. 7.3.4 Power Good Function (PG)
      5. 7.3.5 Output Voltage Setting
      6. 7.3.6 Output Current Limit and Output Short Circuit Protection
      7. 7.3.7 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Mode Operation
      2. 7.4.2 PSM Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Input Capacitor (CIN)
        3. 8.2.2.3 Output Capacitor (COUT)
        4. 8.2.2.4 Softstart Capacitor (CSS)
        5. 8.2.2.5 Power Good Resistor (RPG)
        6. 8.2.2.6 Feedback Resistors (RFBB and RFBT)
      3. 8.2.3 Application Curves
        1. 8.2.3.1 VOUT = 1.2 V
        2. 8.2.3.2 VOUT = 1.8 V
        3. 8.2.3.3 VOUT = 2.5 V
        4. 8.2.3.4 VOUT = 3.3 V
        5. 8.2.3.5 VOUT = 5.0 V
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
    1. 9.1 Voltage Range
    2. 9.2 Current Capability
    3. 9.3 Input Connection
      1. 9.3.1 Voltage Drops
      2. 9.3.2 Stability
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Minimize the High di/dt Loop Area
      2. 10.1.2 Protect the Sensitive Nodes in the Circuit
      3. 10.1.3 Provide Thermal Path and Shielding
    2. 10.2 Layout Example
      1. 10.2.1 High Density Layout Example for Space Constrained Applications
        1. 10.2.1.1 35-mm² Solution Size (Single Sided)
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Development Support
      1. 11.2.1 Custom Design With WEBENCH® Tools
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIL|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.1 Minimize the High di/dt Loop Area

The input capacitor, the VIN terminal, and the GND terminal of the LMZ21700 form a high di/dt loop. Place the input capacitor as close as possible to the VIN and GND terminals of the module IC. This minimizes the area of the high di/dt loop and results in lower inductance in the switching current path. Lower inductance in the switching current path translates to lower voltage spikes on the internal switch node and lower noise on the output voltage. Make the copper traces between the input capacitor and the VIN and GND terminals wide and short for better current handling and minimized parasitic inductance.