SLVSBV8E June   2013  – February 2020 LMZ31704

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Application
  4. 4 Revision History
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Package Specifications
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
  6. 6 Device Information
    1. 6.1 Functional Block Diagram
    2.     Pin Functions
  7. 7 Typical Characteristics (PVIN = VIN = 12 V)
  8. 8 Typical Characteristics (PVIN = VIN = 5 V)
  9. 9 Typical Characteristics (PVIN = 3.3 V, VIN = 5 V)
  10. 10Application Information
    1. 10.1  Adjusting the Output Voltage
    2. 10.2  Capacitor Recommendations for the LMZ31704 Power Supply
      1. 10.2.1 Capacitor Technologies
        1. 10.2.1.1 Electrolytic, Polymer-Electrolytic Capacitors
        2. 10.2.1.2 Ceramic Capacitors
        3. 10.2.1.3 Tantalum, Polymer-Tantalum Capacitors
      2. 10.2.2 Input Capacitor
      3. 10.2.3 Output Capacitor
    3. 10.3  Transient Response
    4. 10.4  Transient Waveforms
    5. 10.5  Application Schematics
    6. 10.6  Custom Design With WEBENCH® Tools
    7. 10.7  VIN and PVIN Input Voltage
    8. 10.8  3.3 V PVIN Operation
    9. 10.9  Power Good (PWRGD)
    10. 10.10 SYNC_OUT
    11. 10.11 Parallel Operation
    12. 10.12 Light Load Efficiency (LLE)
    13. 10.13 Power-Up Characteristics
    14. 10.14 Pre-Biased Start-up
    15. 10.15 Remote Sense
    16. 10.16 Thermal Shutdown
    17. 10.17 Output On/Off Inhibit (INH)
    18. 10.18 Slow Start (SS/TR)
    19. 10.19 Overcurrent Protection
    20. 10.20 Synchronization (CLK)
    21. 10.21 Sequencing (SS/TR)
    22. 10.22 Programmable Undervoltage Lockout (UVLO)
    23. 10.23 Layout Considerations
    24. 10.24 EMI
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.