SNVSA92D September   2015  – June 2018 LMZ36002

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application
      2.      Efficiency vs Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics
    7. 6.7  Typical Characteristics
    8. 6.8  Typical Characteristics
    9. 6.9  Typical Characteristics
    10. 6.10 Typical Characteristics (Thermal Derating)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Switching Frequency (RT)
      3. 7.3.3  Recommended Operating Range
      4. 7.3.4  Synchronization (CLK)
      5. 7.3.5  Output Capacitor Selection
      6. 7.3.6  VERSA-COMP Pin Configurations
      7. 7.3.7  Input Capacitor Selection
      8. 7.3.8  Output On/Off Inhibit (INH/UVLO)
      9. 7.3.9  Under Voltage Lockout (UVLO)
      10. 7.3.10 Remote Sense
      11. 7.3.11 VBSEL
      12. 7.3.12 Soft-Start (SS/TR)
      13. 7.3.13 Power Good (PWRGD) and Pull-up (PWRGD_PU)
      14. 7.3.14 Overcurrent Protection
      15. 7.3.15 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Light Load Operation
      3. 7.4.3 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Minimum External Component Application
        1. 8.1.1.1 Design Requirements
        2. 8.1.1.2 Detailed Design Procedure
          1. 8.1.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.1.1.2.2 Output Voltage Set-Point
          3. 8.1.1.2.3 RT and RTSEL
          4. 8.1.1.2.4 VERSA-COMP
          5. 8.1.1.2.5 VBSEL
          6. 8.1.1.2.6 Input Capacitors
          7. 8.1.1.2.7 Output Capacitors
          8. 8.1.1.2.8 Application Curves
      2. 8.1.2 Typical Application
        1. 8.1.2.1 Design Requirements
      3. 8.1.3 Detailed Design Procedure
        1. 8.1.3.1 Switching Frequency
        2. 8.1.3.2 Power Good
        3. 8.1.3.3 Inhibit Control
        4. 8.1.3.4 VERSA-COMP
        5. 8.1.3.5 VBSEL
        6. 8.1.3.6 Soft-Start Capacitors
        7. 8.1.3.7 Input Capacitors
        8. 8.1.3.8 Output Capacitors
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 EMI
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
      2. 11.1.2 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

To achieve optimal electrical and thermal performance, an optimized PCB layout is required. Figure 38 through Figure 41, shows a typical PCB layout. Some considerations for an optimized layout are:

  • Use large copper areas for power planes (PVIN, VOUT, and PGND) to minimize conduction loss and thermal stress.
  • Place ceramic input and output capacitors close to the device pins to minimize high frequency noise.
  • Locate additional output capacitors between the ceramic capacitor and the load.
  • Keep AGND and PGND separate from one another. The connection is made internal to the device.
  • Place RSET, RRT, and CSS as close as possible to their respective pins.
  • Use multiple vias to connect the power planes to internal layers.