SNVSB53C February   2018  – March 2023 LMZM23600

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 System Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Control Scheme
      2. 8.3.2 Soft-Start Function
      3. 8.3.3 Enable and External UVLO Function
      4. 8.3.4 Current Limit
      5. 8.3.5 Hiccup Mode
      6. 8.3.6 Power Good (PGOOD) Function
      7. 8.3.7 MODE/SYNC Function
        1. 8.3.7.1 Forced PWM Mode
        2. 8.3.7.2 Auto PFM Mode
        3. 8.3.7.3 Dropout Mode
        4. 8.3.7.4 SYNC Operation
      8. 8.3.8 Thermal Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown
      2. 8.4.2 FPWM Operation
      3. 8.4.3 Auto PFM Mode Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Maximum Input Voltage for VOUT < 2.5 V
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Input Capacitor Selection
        3. 9.2.2.3 Output Capacitor Selection
        4. 9.2.2.4 Feedback Voltage Divider for Adjustable Output Voltage Versions
        5. 9.2.2.5 RPU - PGOOD Pullup Resistor
        6. 9.2.2.6 VIN Divider and Enable
      3. 9.2.3 Application Curves
        1. 9.2.3.1 VOUT = 5 V
        2. 9.2.3.2 VOUT = 3.3 V
        3. 9.2.3.3 VOUT = 12 V
        4. 9.2.3.4 VOUT = 15 V
        5. 9.2.3.5 VOUT = 2.5 V
        6. 9.2.3.6 VOUT = 1.2 V and VOUT = 1.8 V
        7. 9.2.3.7 VOUT = 5 V and 3.3 V Fixed Output Options
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Supply Voltage Range
      2. 9.4.2 Supply Current Capability
      3. 9.4.3 Supply Input Connections
        1. 9.4.3.1 Voltage Drops
        2. 9.4.3.2 Stability
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
        1. 9.5.1.1 Thermal Design
      2. 9.5.2 Layout Examples
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
VIN to GND–0.340V
SW to GND–0.3VIN + 0.3V
BOOT to SW–0.33.6V
EN to GND–0.342V
VOUT to GND-0.316V
FB to GND (3.3-V and 5-V options)–0.316V
FB to GND (ADJ option)–0.35.5V
PGOOD to GND–0.316V
PGOOD sink current8mA
MODE/SYNC to GND–0.342V
VCC to GND-0.33.6V
Operating junction temperature, TJ–40125°C
Storage temperature, Tstg–40150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.