SNVSAQ4C December   2017  – March 2023 LMZM23601

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
    1.     Device Comparison
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Scheme
      2. 7.3.2 Soft-Start Function
      3. 7.3.3 Enable and External UVLO Function
      4. 7.3.4 Current Limit
      5. 7.3.5 Hiccup Mode
      6. 7.3.6 Power Good (PGOOD) Function
      7. 7.3.7 MODE/SYNC Function
        1. 7.3.7.1 Forced PWM Mode
        2. 7.3.7.2 Auto PFM Mode
        3. 7.3.7.3 Dropout Mode
        4. 7.3.7.4 SYNC Operation
      8. 7.3.8 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
      2. 7.4.2 FPWM Operation
      3. 7.4.3 Auto PFM Mode Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Maximum Input Voltage for VOUT < 2.5 V
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Input Capacitor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Feedback Voltage Divider for Adjustable Output Voltage Versions
        5. 8.2.2.5 RPU - PGOOD Pullup Resistor
        6. 8.2.2.6 VIN Divider and Enable
      3. 8.2.3 Application Curves
        1. 8.2.3.1 VOUT = 5 V
        2. 8.2.3.2 VOUT = 3.3 V
        3. 8.2.3.3 VOUT = 12 V
        4. 8.2.3.4 VOUT = 15 V
        5. 8.2.3.5 VOUT = 2.5 V
        6. 8.2.3.6 VOUT = 1.2 V and VOUT = 1.8 V
        7. 8.2.3.7 VOUT = 5 V and 3.3 V Fixed Output Options
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Supply Voltage Range
      2. 8.4.2 Supply Current Capability
      3. 8.4.3 Supply Input Connections
        1. 8.4.3.1 Voltage Drops
        2. 8.4.3.2 Stability
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Thermal Design
      2. 8.5.2 Layout Examples
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIL|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)LMZM2360xUNIT
SIL (μSIP)
10 PINS
RθJAJunction-to-ambient thermal resistance45°C/W
ΨJTJunction-to-top characterization parameter3°C/W
ΨJBJunction-to-board characterization parameter20°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.