SBOSA28
august 2023
LOG200
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
High Speed, Logarithmic Current-to-Voltage Conversion
7.3.2
Voltage and Current References
7.3.3
Adaptive Photodiode Bias
7.3.4
Auxiliary Operational Amplifier
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.1.1
Logarithmic Transfer Function
8.1.1.1
Logarithmic Conformity Error
8.2
Typical Application
8.2.1
Optical Current Sensing
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curves
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Device Support
9.1.1
Third-Party Products Disclaimer
9.2
Documentation Support
9.2.1
Related Documentation
9.3
Receiving Notification of Documentation Updates
9.4
Support Resources
9.5
Trademarks
9.6
Electrostatic Discharge Caution
9.7
Glossary
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGT|16
MPQF119H
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbosa28_oa
6.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002
(2)
TBD
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.