SNVS096E June   1999  – July 2016 LP2954 , LP2954A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Dropout Voltage
      2. 7.3.2 Dropout Detection Comparator
      3. 7.3.3 Output Isolation
      4. 7.3.4 Reducing Output Noise
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Input
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
        2. 8.2.2.2 Minimum Load
        3. 8.2.2.3 Programming The Output Voltage
        4. 8.2.2.4 Power Dissipation
        5. 8.2.2.5 Estimating Junction Temperature
        6. 8.2.2.6 Heatsinking the TO-220 Package
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (March 2013) to E Revision

  • Changed "voltage regulator" to "LDO"Go
  • Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; added top nav icon for TI DesignsGo
  • Changed RθJA value for DDPAK/TO-263 from "73°C/W" to "44.3°C/W"; TO-220 from "60°C/W" to "80.3°C/W"; SOIC from "160°C/W" to "105.0°C/W". These values were in former FN 3 to Abs Max tableGo
  • Added Power DissipationGo
  • Added Estimating Junction TemperatureGo

Changes from C Revision (March 2013) to D Revision

  • Changed layout of National Semiconductor data sheet to TI formatGo