SNOS773O March   2000  – December 2023 LP2981-N

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Thermal Shutdown
      6. 6.3.6 Output Pulldown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors for the Legacy Chip
        2. 7.1.1.2 Recommended Capacitors for the New Chip
      2. 7.1.2 Input and Output Capacitor Requirements
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON and OFF Input Operation
      3. 7.2.3 Application Curves
  9. Power Supply Recommendations
  10. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Third-Party Products Disclaimer
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Related Documentation
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1 V, COUT = 4.7 μF, CIN = 1 μF all voltage options, ON/ OFF pin tied to VIN.

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VIN = 6 V, VOUT = 5 V
Figure 5-1 Output Voltage versus Temperature (Legacy Chip)
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VIN = 4.0 V, VOUT = 3.0 V
Figure 5-3 Output Voltage versus Temperature (Legacy Chip)
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VOUT = 5.0 V
Figure 5-5 Output Voltage versus VIN (Legacy Chip)
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VOUT = 3.0 V
Figure 5-7 Output Voltage versus VIN (Legacy Chip)
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VOUT = 3.3 V, IL = 1 mA
Figure 5-9 Output Voltage versus VIN and Temperature (New Chip)
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Figure 5-11 Dropout Voltage (VDO) versus Temperature (Legacy Chip)
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Figure 5-13 Dropout Voltage (VDO) versus Load Current (Legacy Chip)
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Figure 5-15 Ground Pin Current (IGND) versus Temperature (Legacy Chip)
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Figure 5-17 Ground Pin Current (IGND) versus Load Current (Legacy Chip)
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VOUT = 5 V, RL = ∞ and RL = 5 kΩ
Figure 5-19 Input Current versus Input Voltage (VIN) (Legacy Chip)
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VOUT = 3.3 V, RL = 3.3 kΩ
Figure 5-21 Input Current versus Input Voltage (VIN) (New Chip)
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VOUT = 3.3 V, IL = 100 mA
Figure 5-23 Line Transient Response (New Chip)
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VOUT = 3.3 V, IL = 1 mA
Figure 5-25 Line Transient Response (New Chip)
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VOUT = 3.0 V, COUT = 10 μF
Figure 5-27 Load Transient Response (Legacy Chip)
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VOUT = 5.0 V, COUT = 10 μF
Figure 5-29 Load Transient Response (Legacy Chip)
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VIN = 6.0 V
Figure 5-31 Short Circuit Current versus Time (Legacy Chip)
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VIN = 16.0 V
Figure 5-33 Short Circuit Current versus Time (Legacy Chip)
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Figure 5-35 Instantaneous Short Circuit Current versus Temperature (Legacy Chip)
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VIN = 6.0 V
Figure 5-37 Short Circuit Current versus Output Voltage (VOUT) (Legacy Chip)
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VOUT = 3.0 V
Figure 5-39 Output Impedance versus Frequency (Legacy Chip)
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Figure 5-41 Ripple Rejection versus Frequency (Legacy Chip)
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Figure 5-43 Ripple Rejection versus Output Capacitor (CL) & Frequency (New Chip)
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Figure 5-45 Output Noise Density versus Load Current (IL) Frequency (New Chip)
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Figure 5-47 Input-to-Output Leakage versus Temperature (Legacy Chip)
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Figure 5-49 Output Reverse Leakage versus Temperature (New Chip)
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VOUT = 3.3 V, RL = 3.3 kΩ
Figure 5-51 Turn-on Waveform (New Chip)
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VOUT = 5 V, RL = 5 kΩ
Figure 5-53 Turn-off Waveform (New Chip)
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VIN = 4.3 V
Figure 5-55 ON/ OFF Pin Current versus VON/ OFF (New Chip)
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Figure 5-57 ON/ OFF Threshold versus Temperature (Legacy Chip)
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VIN = 4.3 V, VOUT = 3.3 V
Figure 5-2 Output Voltage versus Temperature (Legacy Chip)
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VIN = 4.3 V, VOUT = 3.3 V
Figure 5-4 Output Voltage versus Temperature (New Chip)
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VOUT = 3.3 V
Figure 5-6 Output Voltage versus VIN (Legacy Chip)
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VOUT = 3.3 V
Figure 5-8 Output Voltage versus VIN (New Chip)
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VOUT = 3.3 , IL = 1 mA
Figure 5-10 Line Regulation versus VIN & Temperature (New Chip)
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Figure 5-12 Dropout Voltage (VDO) versus Temperature (New Chip)
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Figure 5-14 Dropout Voltage (VDO) versus Load Current (New Chip)
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Figure 5-16 Ground Pin Current (IGND) versus Temperature (New Chip)
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Figure 5-18 Ground Pin Current (IGND) versus Load Current (New Chip)
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VOUT = 5 V, RL = 500 Ω and RL = 50 Ω
Figure 5-20 Input Current versus Input Voltage (VIN) (Legacy Chip)
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VOUT = 5 V, IL = 100 mA
Figure 5-22 Line Transient Response (Legacy Chip)
GUID-8D071DFA-F2FE-4158-A914-010EA2E845F3-low.png
VOUT = 5 V, IL = 1 mA
Figure 5-24 Line Transient Response (Legacy Chip)
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VOUT = 3.0 V, COUT = 3.3 μF
Figure 5-26 Load Transient Response (Legacy Chip)
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VOUT = 5.0 V, COUT = 3.3 μF
Figure 5-28 Load Transient Response (Legacy Chip)
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VOUT = 3.3 V, COUT = 2.2 μF
Figure 5-30 Load Transient Response (New Chip)
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VIN = 6.0 V
Figure 5-32 Short Circuit Current versus Time (New Chip)
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VIN = 16.0 V
Figure 5-34 Short Circuit Current versus Time (New Chip)
GUID-20231203-SS0I-ND4M-TNGH-1HTC9S3HVJJN-low.svg
Figure 5-36 Instantaneous Short Circuit Current versus Temperature (New Chip)
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Figure 5-38 Short Circuit Current versus Output Voltage (VOUT) (New Chip)
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VOUT = 3.0 V
Figure 5-40 Output Impedance versus Frequency (Legacy Chip)
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Figure 5-42 Ripple Rejection versus Load Current (IL) & Frequency (New Chip)
GUID-D9FDCA07-3430-4C71-B004-A9722E43A7CC-low.png
Figure 5-44 Output Noise Density versus Frequency (Legacy Chip)
GUID-20231125-SS0I-ZHCM-HWLT-WSW4J55CKTQB-low.svg
Figure 5-46 Output Noise Density versus Output Capacitor (CL) Frequency (New Chip)
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Figure 5-48 Output Reverse Leakage versus Temperature (Legacy Chip)
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VOUT = 5 V, RL = 5 kΩ
Figure 5-50 Turn-on Waveform (Legacy Chip)
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VOUT = 5 V, RL = 5 kΩ
Figure 5-52 Turn-off Waveform (Legacy Chip)
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Figure 5-54 ON/ OFF Pin Current versus VON/ OFF (Legacy Chip)
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VIN = 16.0 V
Figure 5-56 ON/ OFF Pin Current versus VON/ OFF (New Chip)
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Figure 5-58 ON/ OFF Threshold versus Temperature (New Chip)