SNOS773O March   2000  – December 2023 LP2981-N

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Thermal Shutdown
      6. 6.3.6 Output Pulldown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors for the Legacy Chip
        2. 7.1.1.2 Recommended Capacitors for the New Chip
      2. 7.1.2 Input and Output Capacitor Requirements
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON and OFF Input Operation
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Third-Party Products Disclaimer
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Related Documentation
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from , to , (from Revision N (April 2016) to Revision O (December 2023))

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed entire document to align with current family formatGo
  • Added M3 devices to documentGo
  • Changed "Nine" to "Assorted"Go
  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed update typical application drawing and change pin names from Vin, Vout to IN and OUT Go
  • Added Output Enable sectionGo
  • Added Dropout Voltage sectionGo
  • Added Current Limit sectionGo
  • Added Undervoltage Lockout (UVLO) sectionGo
  • Added Thermal Shutdown sectionGo
  • Added Output Pulldown sectionGo
  • Added Input and Output Capacitor Requirements sectionGo
  • Added Estimating Junction Temperature sectionGo
  • Added Power Dissipation (PD) sectionGo
  • Added Reverse Current sectionGo
  • Changed layout of National Data Sheet to TI formatGo
  • Added Device Nomenclature sectionGo
  • Added three references to Related Documentation Go

Changes from Revision M (September 2015) to Revision N (April 2016)

  • Changed update typical application drawing and change pin names from Vin, Vout to IN and OUT Go