SNVS128L March   2000  – December 2023 LP2982

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Output Pulldown
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors for the Legacy Chip
        2. 7.1.1.2 Recommended Capacitors for the New Chip
      2. 7.1.2 Input and Output Capacitor Requirements
      3. 7.1.3 Noise Bypass Capacitor (CBYPASS)
      4. 7.1.4 Reverse Current
      5. 7.1.5 Power Dissipation (PD)
      6. 7.1.6 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON/ OFF Input Operation
      3. 7.2.3 Application Curves
  9. Power Supply Recommendations
  10. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Third-Party Products Disclaimer
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

Unless otherwise specified: TA = 25°C, VIN = VO(NOM) + 1 V, COUT = 4.7 μF, CIN = 1 μF, all voltage options, ON/ OFF pin tied to VIN.

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Figure 5-1 Output Voltage versus Temperature (Legacy Chip)
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Figure 5-3 Output Voltage versus Temperature (Legacy Chip)
GUID-58424981-8F06-47D0-8242-2C5CC7E936A8-low.png
 VOUT = 5.0 V
Figure 5-5 Output Voltage versus VIN (Legacy Chip)
GUID-67C488A9-AE34-4C5D-BD3A-35705CDEA441-low.png
 VOUT = 3.0 V
Figure 5-7 Output Voltage versus VIN (Legacy Chip)
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Figure 5-9 Dropout Voltage versus Temperature (Legacy Chip)
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Figure 5-11 Dropout Voltage versus Load Current (Legacy Chip)
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Figure 5-13 Ground Pin Current versus Temperature (Legacy Chip)
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Figure 5-15 Ground Pin Current versus Load Current (Legacy Chip)
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 VOUT = 5 V
Figure 5-17 Input Current versus VIN (Legacy Chip)
GUID-20231024-SS0I-BBVT-CSHJ-VH1PQZSGMQRW-low.svg
 VOUT = 3.3 V
Figure 5-19 Input Current versus Input Voltage (New Chip)
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Figure 5-21 Line Transient Response (Legacy chip)
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Figure 5-23 Load Transient Response (Legacy chip)
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Figure 5-25 Load Transient Response (Legacy chip)
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dI/dt = 1 A/μs
Figure 5-27 Load Transient Response (New Chip)
GUID-4E826D18-3411-4CA1-B006-CC8A63DF4356-low.png
VIN = 16 V
Figure 5-29 Short-Circuit Current versus Time (Legacy chip)
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Figure 5-31 Short-Circuit Current versus Time (New Chip)
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Figure 5-33 Short-Circuit Current versus Temperature (New Chip)
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Figure 5-35 Output Impedance versus Frequency (Legacy chip)
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Figure 5-37 ON/ OFF Pin Current versus VON/OFF (Legacy chip)
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VIN = 4.3 V
Figure 5-39 ON/OFF Pin Current versus VON/OFF (New Chip)
GUID-20231125-SS0I-D1T0-GHZ8-N7CTML9JV1Q9-low.svg
Figure 5-41 ON/ OFF Threshold versus Temperature (New chip)
GUID-E9E9C7DB-51CA-4B5A-88BD-E5AFDA477582-low.png
Figure 5-43 Output Reverse Leakage versus Temperature (Legacy chip)
GUID-87BA6A64-1C9F-48FE-9692-B550AEF980C7-low.png
Figure 5-45 Output Noise Density (Legacy chip)
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Figure 5-47 Output Noise Density (Legacy chip)
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VIN = 4.3V, VOUT = 3.3V, COUT = 2.2μF and ILOAD = 1 mA
Figure 5-49 Output Noise Density versus Frequency for New Chip
GUID-20231128-SS0I-R9S5-46PG-5C6WHNRB3VJ5-low.svg
VOUT = 3.3 V, Cbyp = 0 nF
Figure 5-51 Ripple Rejection versus IOUT (New Chip)
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Figure 5-53 Turnon Waveform (Legacy chip)
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Figure 5-55 Turnon Waveform (Legacy chip)
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Cbyp = 0.1 nF
Figure 5-57 Turnon Waveform (New chip)
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Figure 5-2 Output Voltage versus Temperature (Legacy Chip)
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VIN = 4.3 V, VOUT = 3.3 V
Figure 5-4 Output Voltage versus Temperature (New Chip)
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 VOUT = 3.3 V
Figure 5-6 Output Voltage versus VIN (Legacy Chip)
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VOUT = 3.3 V 
Figure 5-8 Output Voltage versus VIN (New Chip)
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Figure 5-10 Dropout Voltage versus Temperature (New Chip)
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Figure 5-12 Dropout Voltage versus Load Current (New Chip)
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Figure 5-14 Ground Pin Current versus Temperature (New Chip)
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Figure 5-16 Ground Pin Current versus Load Current (New Chip)
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 VOUT = 5 V
Figure 5-18 Input Current versus VIN (Legacy Chip)
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Figure 5-20 Line Transient Response (Legacy chip)
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VOUT = 3.3 V, ΔVIN = 1 V, IOUT = 50 mA, dV/dt = 1 V/μs
Figure 5-22 Line Transient Response (New Chip)
GUID-97D3D6FA-2161-42F7-8D45-027E7D24C11E-low.png
Figure 5-24 Load Transient Response (Legacy chip)
GUID-FAD6FD6A-A4B2-422F-A884-27E0BBA36AC3-low.png
Figure 5-26 Load Transient Response (Legacy chip)
GUID-E6D48EB3-AD30-4C45-A3C6-DCD6E9BA572A-low.png
VIN = 6 V
Figure 5-28 Short-Circuit Current versus Time (Legacy chip)
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VIN = 6 V
Figure 5-30 Short-Circuit Current versus Time (New Chip)
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Figure 5-32 Instantaneous Short-Circuit Current versus Temperature (Legacy chip)
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Figure 5-34 Instantaneous Short Circuit Current versus Output Voltage (Legacy chip)
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Figure 5-36 Output Impedance versus Frequency (Legacy chip)
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VIN = 16 V
Figure 5-38 ON/OFF Pin Current versus VON/OFF (New Chip)
GUID-1C4F6E2D-DF98-49F5-AF74-282EE2AE65E0-low.png
Figure 5-40 ON/ OFF Threshold versus Temperature (Legacy chip)
GUID-3E4C3F72-2FD0-462C-9930-C23A3D763982-low.png
Figure 5-42 Input-to-Output Leakage versus Temperature (Legacy chip)
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Figure 5-44 Output Reverse Leakage versus Temperature (New chip)
GUID-456B42DA-3BB7-4803-B7BE-3A5954F0F53E-low.png
Figure 5-46 Output Noise Density (Legacy chip)
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VIN = 4.3V, VOUT = 3.3V, COUT = 2.2μF and ILOAD = 50 mA
Figure 5-48 Output Noise Density versus Frequency (New Chip)
GUID-3409D123-C4CA-491D-832C-BBF9512BE352-low.png
Figure 5-50 Ripple Rejection (Legacy chip)
GUID-20231128-SS0I-DP0H-ZGZH-GJBVFVTWNZ7J-low.svg
VOUT = 3.3 V, Cbyp = 10 nF
Figure 5-52 Ripple Rejection versus IOUT (New Chip)
GUID-6CD0E335-7AD5-4763-AED1-6D00E27B45B4-low.png
Figure 5-54 Turnon Waveform (Legacy chip)
GUID-20231128-SS0I-JD3B-KQ3D-XPTW1CTJCQRX-low.svg
Cbyp = 0 nF
Figure 5-56 Turnon Waveform (New chip)
GUID-20231128-SS0I-F0ML-J371-RHRRPRNRMVFP-low.svg
Cbyp = 1 nF
Figure 5-58 Turnon Waveform (New chip)