SNVS018AA march 2000 – july 2023 LP2985-N
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
- DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6.6 Typical Characteristics
at operating temperature TJ =
25°C, VIN = VOUT(NOM) + 1.0 V or 2.5 V (whichever is greater),
IOUT = 1 mA, ON/OFF pin tied to VIN,
CIN = 1.0 µF, and COUT = 4.7 µF (unless otherwise
noted)
Figure 6-1 VOUT vs Temperature for Legacy Chip
Figure 6-3 Short-Circuit Current vs Output Voltage for Legacy Chip
Figure 6-5 Ripple Rejection vs Frequency for Legacy Chip
Figure 6-7 Ripple Rejection vs Frequency for Legacy Chip
Figure 6-9 Ripple Rejection vs
Frequency for New Chip
Figure 6-11 Ripple Rejection vs Frequency for Legacy Chip
Figure 6-13 Ripple Rejection vs Frequency for Legacy Chip
Figure 6-15 Ripple Rejection vs Frequency for Legacy Chip
Figure 6-17 Output Impedance vs Frequency for Legacy Chip
Figure 6-19 Output Noise Density for Legacy Chip
Figure 6-21 Output Noise Density for Legacy Chip
Figure 6-23 Ground Pin vs Load Current for Legacy Chip
Figure 6-25 Dropout Voltage vs Temperature for Legacy Chip
Figure 6-27 Input
Current vs VIN for Legacy Chip
Figure 6-29 GND
Pin Current vs Temperature for Legacy Chip
Figure 6-31 Instantaneous Short-Circuit Current for Legacy Chip
Figure 6-2 VOUT vs Temperature for New Chip
Figure 6-4 Short-Circuit Current vs
Output Voltage for New Chip
Figure 6-6 Ripple Rejection vs Frequency for Legacy Chip
Figure 6-8 Ripple Rejection vs Frequency for Legacy Chip
Figure 6-10 Ripple Rejection vs Frequency for Legacy Chip
Figure 6-12 Ripple Rejection vs Frequency for Legacy Chip
Figure 6-14 Ripple Rejection vs
Frequency for New Chip
Figure 6-16 Ripple Rejection vs
Frequency for New Chip
Figure 6-18 Output Impedance vs Frequency for Legacy Chip
Figure 6-20 Output Noise Density vs
Frequency for New Chip
Figure 6-22 Output Noise Density vs
Frequency for New Chip
Figure 6-24 Ground Pin Current vs Load
Current for New Chip
Figure 6-26 Dropout Voltage vs
Temperature for New Chip
Figure 6-28 Input Current vs
VIN for New Chip
Figure 6-30 GND
Pin Current vs Temperature for New Chip
Figure 6-32 Short-Circuit Current vs
Temperature for New Chip
| VIN = 5 V, VOUT = 3.3 V, COUT = 10 μF, CBYP = 0 nF |
| VIN = 4.3 V, VOUT = 3.3 V |
| VIN = 3.7 V, VOUT = 3.3 V, COUT = 10 μF, CBYP = 0 nF |