SNVS137I March   1999  – September 2015 LP2986

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Function
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High-Accuracy Output Voltage
      2. 7.3.2 Error Detection Comparator Output
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Short-Circuit Protection (Current Limit)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Fixed or Adjustable Regulated Output
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Using an External Resistive Divider
        2. 8.2.2.2 External Capacitors
          1. 8.2.2.2.1 Input Capacitor
          2. 8.2.2.2.2 Output Capacitor
        3. 8.2.2.3 Capacitor Characteristics
          1. 8.2.2.3.1 Tantalum
          2. 8.2.2.3.2 Ceramic
          3. 8.2.2.3.3 Aluminum
        4. 8.2.2.4 Reverse Input-Output Voltage
        5. 8.2.2.5 WSON Package Devices
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Function

D Package
8-Pin SOIC
Top View
LP2986 1293502.gif
DGK Package
8-Pin VSSOP
Top View
LP2986 1293546.gif
NGN Package
8-Pin WSON
Top View
LP2986 1293543.gif

Pin Functions: All Packages

PIN I/O DESCRIPTION
NAME NO.
ERROR 7 O Active-low open-collector error output. Goes low when VOUT drops by 5% of its nominal value.
FEEDBACK 2 I Determines the output voltage. Connect to TAP (with OUT tied to SENSE) to output the fixed voltage corresponding to the part version, or connect to a resistor divider to adjust the output voltage (see Typical Applications).
GROUND 1 — Ground.
IN 4 I Input voltage supply.
OUT 5 O Regulated output.
SENSE 6 I Connect to OUT (with FEEDBACK tied to TAP) to output the voltage corresponding to the part version (see Typical Applications).
SHUTDOWN 8 I Active-high. pull low to showdown the output voltage.
TAP 3 O Middle tap of the Internal voltage divider. Tie to FEEDBACK (with OUT tied to SENSE) to output the fixed voltage corresponding to the part version (see Typical Applications).
DAP (Thermal Pad - WSON only) √ — The exposed thermal pad on the bottom of the WSON package should be connected to a copper thermal pad on the PCB under the package. The use of thermal vias to remove heat from the package into the PCB is recommended. Connect the thermal pad to ground potential or leave floating. Do not connect the thermal pad to any potential other than the same ground potential seen at device pin 1. For additional information on using TI's non-pullback WSON package, see Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401).