SNVS083O February   2005  – March 2015 LP2989

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High-Accuracy Output Voltage
      2. 7.3.2 Sleep Mode
      3. 7.3.3 Error Detection Comparator Output
      4. 7.3.4 Short Circuit Protection (Current Limit)
      5. 7.3.5 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With 16 V ≥ VIN > VOUT(TARGET) + 1 V
      2. 7.4.2 Operation with Shutdown Control
      3. 7.4.3 Shutdown Input Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 WSON Package Devices
        2. 8.2.2.2 External Capacitors
          1. 8.2.2.2.1 Input Capacitor
          2. 8.2.2.2.2 Output Capacitor
          3. 8.2.2.2.3 Noise Bypass Capacitor
        3. 8.2.2.3 Capacitor Characteristics
          1. 8.2.2.3.1 Ceramic
          2. 8.2.2.3.2 Tantalum
          3. 8.2.2.3.3 Film
        4. 8.2.2.4 Reverse Input-Output Voltage
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from N Revision (December 2014) to O Revision

  • Changed 30-V to 16-V Go
  • Deleted trademark symbol from VIP which is no longer trademarked Go
  • Changed pin names to TI nomenclature; references to National to TI; add notes to Typical Application on first page; fix errors in EC table reformat; replace Handling Ratings with ESD Ratings; take out Output Voltage Options and add graphic to Mechanical section; changed LLP package name references to WSON; added overbar to SHUTDOWN pin references; fix ulink for LP2989LV references.Go
  • Changed description of N/C pin; add description of Thermal Pad; change "Ground" to "Thermal Pad" for NGN drawing Go
  • Changed reference to National to TI Go
  • Deleted "Operating" row from Input supply voltage; thermal values from footnote 2 Go
  • Changed 1.6 to 16 in ROC input supply voltage Go
  • Added word "OFF" Go
  • Changed "high" to "low" Go
  • Changed wording of "Operation with Shutdown Control" subsection Go
  • Changed VON/OFF to VSDGo
  • Changed "guaranteed" to "ensured" in "CAUTION".Go
  • Changed VON/OFF to VSDGo
  • Changed wording of last sentence of introductory Detailed Design Procedure paragraph Go
  • Changed words "size" and "amount" for capacitors to "value" Go
  • Changed wording of first sentence, second paragraph of Noise Bypass Capacitor subsection Go
  • Added Documentation Support section Go

Changes from M Revision (February 2005) to N Revision

  • Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; add updated Thermal Information values Go