SNVS171L November   2001  – February 2025 LP2992

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
        1. 6.3.3.1 Current Limit (Legacy Chip)
        2. 6.3.3.2 Current Limit (New Chip)
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Output Pulldown
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Estimating Junction Temperature
      2. 7.1.2 Input and Output Capacitor Requirements
      3. 7.1.3 Noise Bypass Capacitor (CBYPASS)
      4. 7.1.4 Power Dissipation (PD)
      5. 7.1.5 Recommended Capacitor Types
        1. 7.1.5.1 Recommended Capacitors (Legacy Chip)
          1. 7.1.5.1.1 Tantalum Capacitors (Legacy Chip)
        2. 7.1.5.2 Recommended Capacitors (New Chip)
      6. 7.1.6 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON/OFF Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Changes from Revision J (January 2017) to Revision K (December 2023)

  • Changed entire document to align with current family formatGo
  • Added M3 devices to document Go
  • Updated the numbering format for tables, figures, and cross-references throughout the document. Go
  • Updated Absolute Maximum Ratings, Recommended Operating Conditions, Electrical Characteristics and Thermal Information for M3-suffix(new chip)Go
  • Changed Current Limit sectionGo
  • Added Output Pulldown sectionGo
  • Added Device Nomenclature sectionGo