SNOSCY7 June   2014 LP2996A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Pin Descriptions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Capacitor
      2. 8.1.2 Output Capacitor
      3. 8.1.3 Thermal Dissipation
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application Circuit
      2. 8.2.2 DDR-III Applications
      3. 8.2.3 DDR-II Applications
      4. 8.2.4 SSTL-2 Applications
      5. 8.2.5 Level Shifting
        1. 8.2.5.1 Output Capacitor Selection
      6. 8.2.6 HSTL Applications
      7. 8.2.7 QDR Applications
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
    4. 10.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.