SNVS324K January   2005  – January 2016 LP38691-ADJ , LP38691-ADJ-Q1 , LP38693-ADJ , LP38693-ADJ-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LP38691-ADJ, LP38693-ADJ
    3. 6.3 ESD Ratings: LP38691-ADJ-Q1, LP38693-ADJ-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Thermal Overload Protection (TSD)
      3. 7.3.3 Foldback Current Limiting
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Setting the Output Voltage
        2. 8.2.2.2  External Capacitors
        3. 8.2.2.3  Input Capacitor
        4. 8.2.2.4  Output Capacitor
        5. 8.2.2.5  Capacitor Characteristics
          1. 8.2.2.5.1 Ceramic Capacitors
          2. 8.2.2.5.2 Tantalum Capacitors
        6. 8.2.2.6  RFI/EMI Susceptibility
        7. 8.2.2.7  Output Noise
        8. 8.2.2.8  Power Dissipation
        9. 8.2.2.9  Estimating Junction Temperature
        10. 8.2.2.10 Reverse Voltage
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from J Revision (October 2015) to K Revision

  • Added Caution note to Foldback Current Limiting subsection Go

Changes from I Revision (April 2013) to J Revision

  • Added Device Information and Pin Configuration and Functions sections, ESD Ratings table, update Thermal Values; add Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; update Vin, Vout and Ven pin names to IN, OUT, and EN in text and graphics; modified wording of Description to eliminate redundancy; added top nav icon for reference design.Go

Changes from H Revision (April 2013) to I Revision

  • Changed layout of National Data Sheet to TI formatGo
  • Changed layout of National Data Sheet to TI format Go