SNVS324K January 2005 – January 2016 LP38691-ADJ , LP38691-ADJ-Q1 , LP38693-ADJ , LP38693-ADJ-Q1
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
V(MAX) All pins (with respect to GND) | –0.3 | 12 | V | |
IOUT(4) | Internally limited | V | ||
Power dissipation(3) | Internally limited | V | ||
Junction temperature | –40 | 150 | °C | |
Storage temperature, Tstg | −65 | 150 |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | 2000 | V |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
VIN supply voltage | 2.7 | 10 | V | ||
Operating junction temperature | −40 | 125 | °C |
THERMAL METRIC(1) | LP3869x-ADJ | LP38693-ADJ | UNIT | |
---|---|---|---|---|
WSON | SOT-223 | |||
6 PINS | 5 PINS | |||
RθJA(2) | Junction-to-ambient thermal resistance, High-K | 50.6 | 68.5(3) | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 44.4 | 52.2 | |
RθJB | Junction-to-board thermal resistance | 24.9 | 13.0 | |
ψJT | Junction-to-top characterization parameter | 0.4 | 5.5 | |
ψJB | Junction-to-board characterization parameter | 25.1 | 12.8 | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 5.4 | n/a |
PARAMETER | TEST CONDITIONS | MIN | TYP(1) | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
VADJ | ADJ pin voltage | VIN = 2.7 V | 1.225 | 1.25 | 1.275 | V | |
3.2 V ≤ VIN ≤ 10 V, 100 µA < IL < 0.5 A | 1.25 | ||||||
3.2 V ≤ VIN ≤ 10 V, 100 µA < IL < 0.5 A Full operating temperature range |
1.2 | 1.3 | |||||
ΔVOUT/ΔVIN | Output voltage line regulation(2) | VOUT + 0.5 V ≤ VIN ≤ 10 V IL = 25 mA |
0.03 | %/V | |||
VOUT + 0.5 V ≤ VIN ≤ 10 V IL = 25 mA Full operating temperature range |
0.1 | ||||||
ΔVOUT/ΔIL | Output voltage load regulation(3) | 1 mA < IL < 0.5 A VIN = VOUT + 1 V |
1.8 | %/A | |||
1 mA < IL < 0.5 A VIN = VOUT + 1 V Full operating temperature range |
5 | ||||||
VDO | Dropout voltage(4) | (VOUT = 2.5 V) | IL = 0.1 A | 80 | mV | ||
IL = 0.5 A | 430 | ||||||
(VOUT = 2.5 V) Full operating temperature range |
IL = 0.1 A | 145 | |||||
IL = 0.5 A | 725 | ||||||
(VOUT = 3.3 V) | IL = 0.1 A | 65 | |||||
IL = 0.5 A | 330 | ||||||
(VOUT = 3.3 V) Full operating temperature range |
IL = 0.1 A | 110 | |||||
IL = 0.5 A | 550 | ||||||
(VOUT = 5 V) | IL = 0.1 A | 45 | |||||
IL = 0.5 A | 250 | ||||||
(VOUT = 5 V) Full operating temperature range |
IL = 0.1 A | 100 | |||||
IL = 0.5 A | 450 | ||||||
IQ | Quiescent current | VIN ≤ 10 V, IL =100 µA – 0.5 A | 55 | µA | |||
VIN ≤ 10 V, IL =100 µA – 0.5 A Full operating temperature range |
100 | ||||||
VEN ≤ 0.4 V, (LP38693 Only) | 0.001 | 1 | |||||
IL(MIN) | Minimum load current | VIN – VOUT ≤ 4 V Full operating temperature range |
100 | ||||
IFB | Foldback current limit | VIN – VOUT > 5 V | 350 | mA | |||
VIN – VOUT < 4 V | 850 | ||||||
PSRR | Ripple rejection | VIN = VOUT + 2 V(DC), with 1 V(p-p) / 120-Hz Ripple | 55 | dB | |||
TSD | Thermal shutdown activation (junction temp) | 160 | °C | ||||
TSD (HYST) | Thermal shutdown hysteresis (junction temp) | 10 | |||||
IADJ | ADJ input leakage current | VADJ = 0 V to 1.5 V, VIN = 10 V | –100 | 0.01 | 100 | nA | |
en | Output noise | BW = 10 Hz to 10 kHz VOUT = 3.3 V |
0.7 | µV/√Hz | |||
VOUT (LEAK) | Output leakage current | VOUT = VOUT(NOM) + 1 V at 10 VIN | 0.5 | 2 | µA | ||
VEN | Enable voltage (LP38693 Only) | Output = OFF state Full operating temperature range |
0.4 | V | |||
Output = ON state, VIN = 4 V Full operating temperature range |
1.8 | ||||||
Output = ON state, VIN = 6 V Full operating temperature range |
3 | ||||||
Output = ON state, VIN = 10 V Full operating temperature range |
4 | ||||||
IEN | EN pin leakage (LP38693 only) |
VEN = 0 V or 10 V, VIN = 10 V | –1 | 0.001 | 1 | µA |
VOUT = 1.25 V |
VOUT = 1.8 V |
VOUT = 1.8 V |