SNVS324K January   2005  – January 2016 LP38691-ADJ , LP38691-ADJ-Q1 , LP38693-ADJ , LP38693-ADJ-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LP38691-ADJ, LP38693-ADJ
    3. 6.3 ESD Ratings: LP38691-ADJ-Q1, LP38693-ADJ-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Thermal Overload Protection (TSD)
      3. 7.3.3 Foldback Current Limiting
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Setting the Output Voltage
        2. 8.2.2.2  External Capacitors
        3. 8.2.2.3  Input Capacitor
        4. 8.2.2.4  Output Capacitor
        5. 8.2.2.5  Capacitor Characteristics
          1. 8.2.2.5.1 Ceramic Capacitors
          2. 8.2.2.5.2 Tantalum Capacitors
        6. 8.2.2.6  RFI/EMI Susceptibility
        7. 8.2.2.7  Output Noise
        8. 8.2.2.8  Power Dissipation
        9. 8.2.2.9  Estimating Junction Temperature
        10. 8.2.2.10 Reverse Voltage
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

NGG Package
6-Pin WSON With Exposed Thermal Pad
LP38691-ADJ Top View
LP38691-ADJ LP38693-ADJ LP38691-ADJ-Q1 LP38693-ADJ-Q1 20126804.gif
NGG Package
6-Pin WSON With Exposed Thermal Pad
LP38693-ADJ Top View
LP38691-ADJ LP38693-ADJ LP38691-ADJ-Q1 LP38693-ADJ-Q1 20126805.gif
NC - No internal connection
NDC Package
5-Pin SOT-223
LP38693-ADJ Top View
LP38691-ADJ LP38693-ADJ LP38691-ADJ-Q1 LP38693-ADJ-Q1 20126803.gif

Pin Functions

PIN I/O DESCRIPTION
LP38691-ADJ LP38693-ADJ
NAME WSON WSON SOT-223
DAP √ √ — — WSON Only - The DAP (exposed pad) functions as a thermal connection when soldered to a copper plane. See WSON Mounting section for more information.
EN — 3 1 I The EN pin allows the part to be turned to an ON or OFF state by pulling this pin high or low.
GND 2 2 5 — Circuit ground for the regulator. For the SOT-223 package this is thermally connected to the die and functions as a heat sink when the soldered down to a large copper plane.
IN 1, 6 1, 6 4 I This is the input supply voltage to the regulator. For WSON devices, both IN pins must be tied together for full current operation (250 mA maximum per pin).
N/C 3 — — — No internal connection.
ADJ 4 4 2 O The ADJ pin is used to set the regulated output voltage by connecting it to the external resistors R1 and R2 (see Typical Application Circuits).
OUT 5 5 3 I Regulated output voltage.