SNVS323 Data sheet

SNVS323I December 2004 – February 2016 LP38690-ADJ , LP38692-ADJ

PRODUCTION DATA.

Package Options

Mechanical Data (Package|Pins)

NGG|6
- MPDS395
NDC|5
- MPDS385

Thermal pad, mechanical data (Package|Pins)

Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

see ⁽¹⁾⁽²⁾

	MIN	MAX	UNIT
All pins (with respect to GND), V_MAX	–0.3	12	V
I_OUT⁽⁴⁾	Internally Limited
Power dissipation⁽³⁾	Internally Limited
Junction temperature	−40	150	°C
Storage temperature, T_stg	−65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications.

(3) At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a heatsink is used). When using the WSON package, refer to Leadless Leadframe Package (LLP) (SNOA401) and the WSON Mounting section in this datasheet. If power dissipation causes the junction temperature to exceed specified limits, the device goes into thermal shutdown.

(4) If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to ground.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	2000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

		MIN	MAX	UNIT
Supply voltage, V_IN		2.7	10	V
Operating junction temperature, T_J		–40	125	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LP38692-ADJ	LP3869x-ADJ	UNIT
		NDC (SOT-223)	NGG (WSON)
		5 PINS	6 PINS
R_θJA⁽²⁾	Junction-to-ambient thermal resistance, High-K	68.5	50.6⁽³⁾	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	52.2	44.4	°C/W
R_θJB	Junction-to-board thermal resistance	13.0	24.9	°C/W
ψ_JT	Junction-to-top characterization parameter	5.5	0.4	°C/W
ψ_JB	Junction-to-board characterization parameter	12.8	25.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	5.4	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

(2) Thermal resistance value R_θJA is based on EIA/JEDEC High-K printed circuit board defined by: JESD51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.

(3) The PCB for the WSON (NGG) package R_θJA includes four (4) thermal vias under the exposed thermal pad per EIA/JEDEC JESD51-5.

6.5 Electrical Characteristics

Unless otherwise specified: typical limits are for T_J = 25°C, minimum and maximum limits apply over the full operating temperature range; V_IN = V_OUT + 1 V , C_IN = C_OUT = 10 µF, I_LOAD = 10 mA. Minimum and maximum limits are specified through testing, statistical correlation, or design.

PARAMETER		TEST CONDITIONS	MIN	TYP⁽¹⁾	MAX	UNIT
V_ADJ	ADJ pin voltage	V_IN = 2.7 V, T_J = 25°C	1.219	1.25	1.281	V
V_ADJ	ADJ pin voltage	3.2 V ≤ V_IN ≤ 10 V 100 µA < I_LOAD < 1 A	1.187	1.25	1.313	V
ΔV_OUT/ΔV_IN	Output voltage line regulation⁽²⁾	V_OUT + 0.5 V ≤ V_IN ≤ 10 V I_LOAD = 25 mA		0.03	0.1	%/V
ΔV_OUT/ΔI_LOAD	Output voltage load regulation⁽³⁾	1 mA < I_LOAD < 1 A V_IN = V_OUT + 1 V		1.8	5	%/A
V_IN – V_OUT	Dropout voltage⁽⁴⁾	V_OUT = 1.8 V, I_LOAD = 1 A		950	1600	mV
		V_OUT = 2.5 V, I_LOAD = 0.1 A		80	145
		V_OUT = 2.5 V, I_LOAD = 1A		800	1300
		V_OUT = 3.3 V, I_LOAD = 0.1 A		65	110
		V_OUT = 3.3 V, I_LOAD = 1 A		650	1000
		V_OUT = 5 V, I_LOAD = 0.1 A		45	100
		V_OUT = 5 V, I_LOAD = 1 A		450	800
I_Q	Quiescent current	V_IN ≤ 10 V, I_LOAD = 100 µA – 1A		55	100	µA
I_Q	Quiescent current	V_EN ≤ 0.4 V, T_J = 25°C (LP38692-ADJ Only)		0.001	1	µA
I_L(MIN)	Minimum load current	V_IN – V_OUT ≤ 4 V			100	µA
I_FB	Foldback current limit	V_IN – V_OUT > 5 V		450		mA
I_FB	Foldback current limit	V_IN – V_OUT < 4 V		1500		mA
PSRR	Ripple rejection	V_IN = V_OUT + 2 V_(DC), with 1 V_(p-p) / 120-Hz ripple		55		dB
T_SD	Thermal shutdown activation (junction temperature)			160		°C
T_SD (HYST)	Thermal shutdown hysteresis (junction temperature)			10		°C
I_ADJ	ADJ input leakage current	V_ADJ = 0 –1.5 V V_IN = 10 V, T_J = 25°C	–100	0.01	100	nA
e_n	Output noise	BW = 10 Hz to 10 kHz V_OUT = 3.3 V		0.7		µV/√Hz
V_OUT (LEAK)	Output leakage current	V_OUT = V_OUT(NOM) + 1 V at 10 V_IN T_J = 25°C		0.5	2	µA
V_EN	Enable voltage (LP38692-ADJ Only)	Output = OFF			0.4	V
		Output = ON, V_IN = 4 V	1.8
		Output = ON, V_IN = 6 V	3
		Output = ON, V_IN = 10 V	4
I_EN	Enable pin leakage (LP38692-ADJ Only)	V_EN = 0 V or 10 V , V_IN = 10 V T_J = 25°C	–1	0.001	1	µA

(1) Typical numbers represent the most likely parametric norm for 25°C operation.

(2) Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.

(3) Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from 1 mA to full load.

(4) Dropout voltage is defined as the minimum input to output differential required to maintain the output within 100 mV of nominal value.

6.6 Typical Characteristics

Unless otherwise specified: T_J = 25°C, C_IN = C_OUT = 10 µF, EN pin is tied to V_IN (LP38692-ADJ only), V_OUT = 1.25 V, V_IN = 2.7 V, I_LOAD = 10 mA.