SNVS322M December   2004  – December 2015 LP38690 , LP38692

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Thermal Shutdown Protection (TSD)
      3. 7.3.3 Foldback Current Limiting
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
      2. 7.4.2 Minimum Operating Input Voltage (VIN)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Reverse Voltage
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Dissipation and Device Operation
        2. 8.2.2.2 External Capacitors
          1. 8.2.2.2.1 Input Capacitor
          2. 8.2.2.2.2 Output Capacitor
          3. 8.2.2.2.3 No Load Stability
          4. 8.2.2.2.4 Capacitor Characteristics
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 PCB Layout
    2. 10.2 Layout Examples
    3. 10.3 WSON Mounting
    4. 10.4 RFI/EMI Susceptibility
    5. 10.5 Output Noise
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from L Revision (March 2015) to M Revision

  • Added top navigator icon for TI Designs Go
  • Added Caution note to Foldback Current Limiting subsection Go

Changes from K Revision (December 2014) to L Revision

  • Changed "mA" back to "mV" - error from SDS conversion.Go

Changes from J Revision (April 2013) to K Revision

  • Changed Device Information and ESD Rating tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; update Thermal Values moved some curves to Application Curves section; change package name PFM to TO-252 (National to TI nomenclature) and pin names from VIN, VOUT to IN, OUT. Go

Changes from I Revision (April 2013) to J Revision

  • Changed layout of National Data Sheet to TI formatGo