SNVS225H February   2003  – June 2015 LP3871 , LP3874

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Shutdown (SD)
      2. 7.3.2 Short-Circuit Protection
      3. 7.3.3 Low Dropout Voltage
      4. 7.3.4 SENSE Pin
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 ERROR Flag Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Reverse Current Path
      2. 8.1.2 Turnon Characteristics for Output Voltages Programmed To 2 V or Below
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
        2. 8.2.2.2 Selecting a Capacitor
        3. 8.2.2.3 Capacitor Characteristics
          1. 8.2.2.3.1 Ceramic
          2. 8.2.2.3.2 Tantalum
          3. 8.2.2.3.3 Aluminum
        4. 8.2.2.4 RFI/EMI Susceptibility
        5. 8.2.2.5 Output Noise
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Dissipation
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from G Revision (April 2013) to H Revision

  • Added Pin Configuration and Functions section, ESD Rating table, Feature Description , Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support , and Mechanical, Packaging, and Orderable Information sections; conform pin names in graphics to TI nomenclatureGo
  • Deleted Lead temperature row - information in POA Go
  • Deleted Heatsinking subsections regarding specific packages as specs have been updated (see Thermal Information). Go
  • Changed layout examples to eliminate obsolete thermal-value references Go

Changes from F Revision (April 2013) to G Revision

  • Changed layout of National Data Sheet to TI formatGo