SNVS247E September   2003  – August 2016 LP3875-ADJ

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Shutdown (SD)
      2. 7.3.2 Short-Circuit Protection
      3. 7.3.3 Dropout Voltage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Reverse Current Path
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  External Capacitors
        2. 8.2.2.2  CFF (Feed Forward Capacitor)
        3. 8.2.2.3  Selecting a Capacitor
        4. 8.2.2.4  Capacitor Characteristics
          1. 8.2.2.4.1 Ceramic
          2. 8.2.2.4.2 Tantalum
          3. 8.2.2.4.3 Aluminum
        5. 8.2.2.5  Setting The Output Voltage
        6. 8.2.2.6  Turnon Characteristics for Output Voltages Programmed to 2 V or Less
        7. 8.2.2.7  RFI/EMI Susceptibility
        8. 8.2.2.8  Output Noise
        9. 8.2.2.9  Power Dissipation
        10. 8.2.2.10 Estimating Junction Temperature
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (April 2013) to E Revision

  • Added Device Information table, Pin Configuration and Functions section, ESD Ratings and Thermal Information tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed "Linear Regulator" in title and text of page 1 to "LDO"Go
  • Deleted all information re: TO-220 package, which is obsolete. Go
  • Changed all VIN and VOUT pin names to IN and OUT in drawings and textGo
  • Deleted "(survival)" from Abs Max rows Go
  • Changed Changed RθJA values: SOT-223 package from "90°C/W" to "65.2°C/W, DDPAK/TO-263 package from "60°C/W" to "40.3°C/W".Go
  • Added updated Thermal Values table and footnotesGo
  • Deleted all "Heatsinking" subsections as they have out-of-date information; added Power Dissipation and Estimating Junction Temperature Go

Changes from C Revision (April 2013) to D Revision

  • Changed layout of National Semiconductor data sheet to TI formatGo