4 Revision History
Changes from D Revision (April 2013) to E Revision
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Added Device Information table, Pin Configuration and Functions section, ESD Ratings and Thermal Information tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
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Changed "Linear Regulator" in title and text of page 1 to "LDO"Go
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Deleted all information re: TO-220 package, which is obsolete. Go
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Changed all VIN and VOUT pin names to IN and OUT in drawings and textGo
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Deleted "(survival)" from Abs Max rows Go
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Changed Changed RθJA values: SOT-223 package from "90°C/W" to "65.2°C/W, DDPAK/TO-263 package from "60°C/W" to "40.3°C/W".Go
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Added updated Thermal Values table and footnotesGo
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Deleted all "Heatsinking" subsections as they have out-of-date information; added Power Dissipation and Estimating Junction Temperature Go
Changes from C Revision (April 2013) to D Revision
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Changed layout of National Semiconductor data sheet to TI formatGo