4 Revision History
Changes from E Revision (April 2013) to F Revision
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Added Device Information and Pin Configuration and Functions sections, ESD Ratings table, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; remove lead temp from Abs Max (in POA), remove obsolete heatsinking contentGo
Changes from D Revision (April 2013) to E Revision
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Changed layout of National data sheet to TI format Go