SLVSEB8C October   2018  – July 2024 LP5018 , LP5024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Control for Each Channel
        1. 7.3.1.1 Independent Color Mixing Per RGB LED Module
        2. 7.3.1.2 Independent Intensity Control Per RGB LED Module
          1. 7.3.1.2.1 Intensity-Control Register Configuration
          2. 7.3.1.2.2 Logarithmic- or Linear-Scale Intensity Control
        3. 7.3.1.3 12-Bit, 29-kHz PWM Generator Per Channel
          1. 7.3.1.3.1 PWM Generator
        4. 7.3.1.4 PWM Phase-Shifting
      2. 7.3.2 LED Bank Control
      3. 7.3.3 Current Range Setting
      4. 7.3.4 Automatic Power-Save Mode
      5. 7.3.5 Protection Features
        1. 7.3.5.1 Thermal Shutdown
        2. 7.3.5.2 UVLO
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C Slave Addressing
        5. 7.5.1.5 Control-Register Write Cycle
        6. 7.5.1.6 Control-Register Read Cycle
        7. 7.5.1.7 Auto-Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1  DEVICE_CONFIG0 (Address = 0h) [reset = 0h]
      2. 7.6.2  DEVICE_CONFIG1 (Address = 1h) [reset = 3Ch]
      3. 7.6.3  LED_CONFIG0 (Address = 2h) [reset = 00h]
      4. 7.6.4  BANK_BRIGHTNESS (Address = 3h) [reset = FFh]
      5. 7.6.5  BANK_A_COLOR (Address = 4h) [reset = 00h]
      6. 7.6.6  BANK_B_COLOR (Address = 5h) [reset = 00h]
      7. 7.6.7  BANK_C_COLOR (Address = 6h) [reset = 00h]
      8. 7.6.8  LED0_BRIGHTNESS (Address = 7h) [reset = FFh]
      9. 7.6.9  LED1_BRIGHTNESS (Address = 8h) [reset = FFh]
      10. 7.6.10 LED2_BRIGHTNESS (Address = 9h) [reset = FFh]
      11. 7.6.11 LED3_BRIGHTNESS (Address = 0Ah) [reset = FFh]
      12. 7.6.12 LED4_BRIGHTNESS (Address = 0Bh) [reset = FFh]
      13. 7.6.13 LED5_BRIGHTNESS (Address = 0Ch) [reset = FFh]
      14. 7.6.14 LED6_BRIGHTNESS (Address = 0Dh) [reset = FFh]
      15. 7.6.15 LED7_BRIGHTNESS (Address = 0Eh) [reset = FFh]
      16. 7.6.16 OUT0_COLOR (Address = 0Fh) [reset = 00h]
      17. 7.6.17 OUT1_COLOR (Address = 10h) [reset = 00h]
      18. 7.6.18 OUT2_COLOR (Address = 11h) [reset = 00h]
      19. 7.6.19 OUT3_COLOR (Address = 12h) [reset = 00h]
      20. 7.6.20 OUT4_COLOR (Address = 13h) [reset = 00h]
      21. 7.6.21 OUT5_COLOR (Address = 14h) [reset = 00h]
      22. 7.6.22 OUT6_COLOR (Address = 15h) [reset = 00h]
      23. 7.6.23 OUT7_COLOR (Address = 16h) [reset = 00h]
      24. 7.6.24 OUT8_COLOR (Address = 17h) [reset = 00h]
      25. 7.6.25 OUT9_COLOR (Address = 18h) [reset = 00h]
      26. 7.6.26 OUT10_COLOR (Address = 19h) [reset = 00h]
      27. 7.6.27 OUT11_COLOR (Address = 1Ah) [reset = 00h]
      28. 7.6.28 OUT12_COLOR (Address = 1Bh) [reset = 00h]
      29. 7.6.29 OUT13_COLOR (Address = 1Ch) [reset = 00h]
      30. 7.6.30 OUT14_COLOR (Address = 1Dh) [reset = 00h]
      31. 7.6.31 OUT15_COLOR (Address = 1Eh) [reset = 00h]
      32. 7.6.32 OUT16_COLOR (Address = 1Fh) [reset = 00h]
      33. 7.6.33 OUT17_COLOR (Address = 20h) [reset = 00h]
      34. 7.6.34 OUT18_COLOR (Address = 21h) [reset = 00h]
      35. 7.6.35 OUT19_COLOR (Address = 22h) [reset = 00h]
      36. 7.6.36 OUT20_COLOR (Address = 23h) [reset = 00h]
      37. 7.6.37 OUT21_COLOR (Address = 24h) [reset = 00h]
      38. 7.6.38 OUT22_COLOR (Address = 25h) [reset = 00h]
      39. 7.6.39 OUT23_COLOR (Address = 26h) [reset = 00h]
      40. 7.6.40 RESET (Address = 27h) [reset = 00h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Related Links
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

LP5018 LP5024 LP5018 RSM Package32-Pin VQFN With Exposed Thermal PadTop View Figure 5-1 LP5018 RSM Package32-Pin VQFN With Exposed Thermal PadTop View
LP5018 LP5024 LP5024 RSM Package32-Pin VQFN With Exposed Thermal PadTop View Figure 5-2 LP5024 RSM Package32-Pin VQFN With Exposed Thermal PadTop View
LP5018 LP5024 LP5018 DGS Package28-pin VSSOP Top View Figure 5-3 LP5018 DGS Package28-pin VSSOP Top View
Table 5-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
LP5018RSM LP5024RSM LP5018DGS
ADDR0 25 25 11 — I2C slave-address selection pin. This pin must not be left floating.
ADDR1 26 26 12 — I2C slave-address selection pin. This pin must not be left floating.
EN 30 30 16 I Chip enable input pin
IREF 31 31 17 — Output current-reference global-setting pin
NC 19, 20, 21, 22, 23, 24 — — — No internal connection
OUT0 1 1 19 O Current sink output 0. If not used, this pin can be left floating.
OUT1 2 2 20 O Current sink output 1. If not used, this pin can be left floating.
OUT2 3 3 21 O Current sink output 2. If not used, this pin can be left floating.
OUT3 4 4 22 O Current sink output 3. If not used, this pin can be left floating.
OUT4 5 5 23 O Current sink output 4. If not used, this pin can be left floating.
OUT5 6 6 24 O Current sink output 5. If not used, this pin can be left floating.
OUT6 7 7 25 O Current sink output 6. If not used, this pin can be left floating.
OUT7 8 8 26 O Current sink output 7. If not used, this pin can be left floating.
OUT8 9 9 27 O Current sink output 8. If not used, this pin can be left floating.
OUT9 10 10 1 O Current sink output 9. If not used, this pin can be left floating.
OUT10 11 11 2 O Current sink output 10. If not used, this pin can be left floating.
OUT11 12 12 3 O Current sink output 11. If not used, this pin can be left floating.
OUT12 13 13 4 O Current sink output 12. If not used, this pin can be left floating.
OUT13 14 14 5 O Current sink output 13. If not used, this pin can be left floating.
OUT14 15 15 6 O Current sink output 14. If not used, this pin can be left floating.
OUT15 16 16 7 O Current sink output 15. If not used, this pin can be left floating.
OUT16 17 17 8 O Current sink output 16. If not used, this pin can be left floating.
OUT17 18 18 9 O Current sink output 17. If not used, this pin can be left floating.
OUT18 — 19 — O Current sink output 18. If not used, this pin can be left floating.
OUT19 — 20 — O Current sink output 19. If not used, this pin can be left floating.
OUT20 — 21 — O Current sink output 20. If not used, this pin can be left floating.
OUT21 — 22 — O Current sink output 21. If not used, this pin can be left floating.
OUT22 — 23 — O Current sink output 22. If not used, this pin can be left floating.
OUT23 — 24 — O Current sink output 23. If not used, this pin can be left floating.
SCL 29 29 15 I I2C bus clock line. If not used, this pin must be connected to GND or VCC.
SDA 28 28 14 I/O I2C bus data line. If not used, this pin must be connected to GND or VCC.
VCAP 32 32 18 — Internal LDO output pin, this pin must be connected to a 1µF capacitor to GND. Place the capacitor as close to the device as possible.
VCC 27 27 13 I Input power.
GND GND GND 10, 28 — Exposed thermal pad also serves the ground pin for the device.