SLVSEB8C October   2018  – July 2024 LP5018 , LP5024

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Control for Each Channel
        1. 7.3.1.1 Independent Color Mixing Per RGB LED Module
        2. 7.3.1.2 Independent Intensity Control Per RGB LED Module
          1. 7.3.1.2.1 Intensity-Control Register Configuration
          2. 7.3.1.2.2 Logarithmic- or Linear-Scale Intensity Control
        3. 7.3.1.3 12-Bit, 29-kHz PWM Generator Per Channel
          1. 7.3.1.3.1 PWM Generator
        4. 7.3.1.4 PWM Phase-Shifting
      2. 7.3.2 LED Bank Control
      3. 7.3.3 Current Range Setting
      4. 7.3.4 Automatic Power-Save Mode
      5. 7.3.5 Protection Features
        1. 7.3.5.1 Thermal Shutdown
        2. 7.3.5.2 UVLO
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C Slave Addressing
        5. 7.5.1.5 Control-Register Write Cycle
        6. 7.5.1.6 Control-Register Read Cycle
        7. 7.5.1.7 Auto-Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1  DEVICE_CONFIG0 (Address = 0h) [reset = 0h]
      2. 7.6.2  DEVICE_CONFIG1 (Address = 1h) [reset = 3Ch]
      3. 7.6.3  LED_CONFIG0 (Address = 2h) [reset = 00h]
      4. 7.6.4  BANK_BRIGHTNESS (Address = 3h) [reset = FFh]
      5. 7.6.5  BANK_A_COLOR (Address = 4h) [reset = 00h]
      6. 7.6.6  BANK_B_COLOR (Address = 5h) [reset = 00h]
      7. 7.6.7  BANK_C_COLOR (Address = 6h) [reset = 00h]
      8. 7.6.8  LED0_BRIGHTNESS (Address = 7h) [reset = FFh]
      9. 7.6.9  LED1_BRIGHTNESS (Address = 8h) [reset = FFh]
      10. 7.6.10 LED2_BRIGHTNESS (Address = 9h) [reset = FFh]
      11. 7.6.11 LED3_BRIGHTNESS (Address = 0Ah) [reset = FFh]
      12. 7.6.12 LED4_BRIGHTNESS (Address = 0Bh) [reset = FFh]
      13. 7.6.13 LED5_BRIGHTNESS (Address = 0Ch) [reset = FFh]
      14. 7.6.14 LED6_BRIGHTNESS (Address = 0Dh) [reset = FFh]
      15. 7.6.15 LED7_BRIGHTNESS (Address = 0Eh) [reset = FFh]
      16. 7.6.16 OUT0_COLOR (Address = 0Fh) [reset = 00h]
      17. 7.6.17 OUT1_COLOR (Address = 10h) [reset = 00h]
      18. 7.6.18 OUT2_COLOR (Address = 11h) [reset = 00h]
      19. 7.6.19 OUT3_COLOR (Address = 12h) [reset = 00h]
      20. 7.6.20 OUT4_COLOR (Address = 13h) [reset = 00h]
      21. 7.6.21 OUT5_COLOR (Address = 14h) [reset = 00h]
      22. 7.6.22 OUT6_COLOR (Address = 15h) [reset = 00h]
      23. 7.6.23 OUT7_COLOR (Address = 16h) [reset = 00h]
      24. 7.6.24 OUT8_COLOR (Address = 17h) [reset = 00h]
      25. 7.6.25 OUT9_COLOR (Address = 18h) [reset = 00h]
      26. 7.6.26 OUT10_COLOR (Address = 19h) [reset = 00h]
      27. 7.6.27 OUT11_COLOR (Address = 1Ah) [reset = 00h]
      28. 7.6.28 OUT12_COLOR (Address = 1Bh) [reset = 00h]
      29. 7.6.29 OUT13_COLOR (Address = 1Ch) [reset = 00h]
      30. 7.6.30 OUT14_COLOR (Address = 1Dh) [reset = 00h]
      31. 7.6.31 OUT15_COLOR (Address = 1Eh) [reset = 00h]
      32. 7.6.32 OUT16_COLOR (Address = 1Fh) [reset = 00h]
      33. 7.6.33 OUT17_COLOR (Address = 20h) [reset = 00h]
      34. 7.6.34 OUT18_COLOR (Address = 21h) [reset = 00h]
      35. 7.6.35 OUT19_COLOR (Address = 22h) [reset = 00h]
      36. 7.6.36 OUT20_COLOR (Address = 23h) [reset = 00h]
      37. 7.6.37 OUT21_COLOR (Address = 24h) [reset = 00h]
      38. 7.6.38 OUT22_COLOR (Address = 25h) [reset = 00h]
      39. 7.6.39 OUT23_COLOR (Address = 26h) [reset = 00h]
      40. 7.6.40 RESET (Address = 27h) [reset = 00h]
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. Device and Documentation Support
    1. 9.1 Related Links
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Design Procedure

LP50xx scales up the reference current (IREF) set by the external resistor (RIREF) to sink the output current (IOUT) at each output port. The following formula can be used to calculate the external resistor (RIREF):

Equation 2. LP5018 LP5024

The SCL and SDA lines must each have a pullup resistor placed somewhere on the line (the pullup resistors are normally located on the bus master). In typical applications, values of 1.8kΩ to 4.7kΩ are used.

VCAP is internal LDO output pin. This pin must be connected through a 1µF capacitor to GND. Place the capacitor as close to the device as possible.

TI recommends having a 1µF capacitor between VCC and GND to ensure proper operation. Place the capacitor as close to the device as possible.