SNVS440B May   2007  – March 2016 LP5520

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Function
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  RGB Driver Electrical Characteristics (ROUT, GOUT, BOUT Outputs)
    7. 6.7  Logic Interface Characteristics
    8. 6.8  Magnetic Boost DC-DC Converter Electrical Characteristics
    9. 6.9  I2C Timing Parameters
    10. 6.10 SPI Timing Requirements
    11. 6.11 Typical Characteristics
      1. 6.11.1 RGB Driver Typical Characteristics
      2. 6.11.2 Boost Converter Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Start-Up Powering
      2. 7.3.2 RGB Driver Functionality
        1. 7.3.2.1 White Balance Control
        2. 7.3.2.2 LED Brightness Control
        3. 7.3.2.3 LED PWM Control
        4. 7.3.2.4 Sequential Mode
        5. 7.3.2.5 Current Control of the LEDs
        6. 7.3.2.6 Output Enables
        7. 7.3.2.7 Fade In and Fade Out
        8. 7.3.2.8 Temperature and Light Measurement
      3. 7.3.3 Magnetic High-Voltage Boost DC-DC Converter
        1. 7.3.3.1 Boost Control
        2. 7.3.3.2 Adaptive Output Voltage Control
    4. 7.4 Device Functional Modes
      1. 7.4.1 Manual Mode
      2. 7.4.2 Automatic Mode
      3. 7.4.3 Stand-Alone Mode
      4. 7.4.4 Start-Up Sequence
    5. 7.5 Programming
      1. 7.5.1 Control Interface
        1. 7.5.1.1 I2C Compatible Interface
          1. 7.5.1.1.1 I2C Signals
          2. 7.5.1.1.2 I2C Data Validity
          3. 7.5.1.1.3 I2C Start and Stop Conditions
          4. 7.5.1.1.4 Transferring Data
        2. 7.5.1.2 SPI Interface
          1. 7.5.1.2.1 SPI Incremental Addressing
      2. 7.5.2 EEPROM Memory
    6. 7.6 Register Maps
      1. 7.6.1 LP5520 Registers, Control Bits, and Default Values
        1. 7.6.1.1 Register Bit Conventions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application: I2C-Bus Control
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Recommended External Components
            1. 8.2.1.2.1.1 Output Capacitor: COUT
            2. 8.2.1.2.1.2 Input Capacitor: CIN
            3. 8.2.1.2.1.3 Output Diode: DOUT
            4. 8.2.1.2.1.4 EMI Filter Components: CSW, RSW, LSW And CHF
            5. 8.2.1.2.1.5 Inductor: L1
            6. 8.2.1.2.1.6 List Of Recommended External Components
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Stand-Alone Typical Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

For additional information, see the following:

    DSBGA Wafer Level Chip Scale Package (SNVA009)

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

SPI is a trademark of Motorola.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.